公开(公告)号：US4654116A

公开(公告)日：1987-03-31

申请号：US669920

申请日：1984-11-09

Applicant: Edward T. Spacer

Inventor： Edward T. Spacer

IPC: C23F1/02 ,  H05K1/03 ,  H05K3/06 ,  H05K3/24 ,  H05K3/26 ,  H05K3/38 ,  B44C1/22

CPC classification number: H05K3/067 ,  C23F1/02 ,  H05K3/26 ,  H05K1/034 ,  H05K2201/0761 ,  H05K2203/0723 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K3/244 ,  H05K3/386

Abstract: A method for producing high resolution etched circuit patterns from a metal clad laminate of a conductive species on a nonconductive substrate is provided. The laminate is etched with an etchant solution for the conductive species to form a circuit pattern. The etched laminate is contacted with an oxidizing agent and aqueous acid to remove redeposited conductive species from the exposed substrate adjacent the circuit pattern. The side walls of the resulting circuit pattern are substantially vertical and free of "halo".

Abstract translation: 提供了一种从非导电基底上的导电物质的金属覆层层压板制造高分辨率蚀刻电路图案的方法。 用导电物质的蚀刻剂溶液蚀刻层压体以形成电路图案。 将蚀刻的层压体与氧化剂和酸水接触以从邻近电路图案的暴露的基板去除再沉积的导电物质。 所得电路图案的侧壁基本垂直并且没有“晕”。