公开(公告)号：US10461299B1

公开(公告)日：2019-10-29

申请号：US14058683

申请日：2013-10-21

申请人： Electrochem Solutions, Inc.

发明人： Ernest M. McKinnon ,  John Hession ,  Renato Avelar ,  Bertrand Nelvy

IPC分类号： H01M2/02 ,  H01M2/20

摘要： Various embodiments of an electrochemical cell interconnect assembly are described. The interconnect assembly is designed to be positioned between two adjacent electrochemical cells, providing an electrical conduit therebetween. The interconnect assembly consists of an interconnect body having a curved formed and an interwoven wire structure. The interconnect assembly is designed to provide a robust electrical connection between two adjacent electrochemical cells in extreme mechanical stress and temperature environments.