公开(公告)号：US10403557B2

公开(公告)日：2019-09-03

申请号：US15531900

申请日：2015-11-23

Applicant: Element Six Technologies Limited

Inventor： Julian Anaya Calvo ,  Martin Hermann Hans Kuball ,  Julian James Sargood Ellis ,  Daniel James Twitchen

IPC: H01L23/373 ,  C04B37/00 ,  C09K5/14 ,  H01L23/498

Abstract: A semiconductor device comprising: a semiconductor component; a diamond heat spreader; and a metal bond, wherein the semiconductor component is bonded to the diamond heat spreader via the metal bond, wherein the metal bond comprises a layer of chromium bonded to the diamond heat spreader and a further metal layer disposed between the layer of chromium and the semiconductor component, and wherein the semiconductor component is configured to operate at an areal power density of at least 1 kW/cm2 and/or a linear power density of at least 1 W/mm.