公开(公告)号：US5105336A

公开(公告)日：1992-04-14

申请号：US630724

申请日：1990-12-20

申请人： Eliot G. Jacoby ,  Walter S. Zaharchuk ,  Zalman A. Liss ,  Denis P. Darragh ,  Dat V. Ngo

发明人： Eliot G. Jacoby ,  Walter S. Zaharchuk ,  Zalman A. Liss ,  Denis P. Darragh ,  Dat V. Ngo

IPC分类号： H02B1/56 ,  H05K7/20

CPC分类号： H05K7/20127 ,  H02B1/565

摘要： An electronic cabinet is described which contains both control circuits containing heat producing components and a plurality of circuit breakers. The control circuits and the circuit breakers are located inside the cabinet with heat dissipating fins being located outside of the cabinet in a heat dissipating chimney. Air moves through the chimney by convection and cooperates with the heat dissipating fins to dissipate most of the heat generated by the heat-generating components of the control circuits. Openings are provided in the cabinet to permit cooling air to pass through the interior of the cabinet and over the control circuit components. These two paths of cooling air cooperate to reduce the temperature in the cabinet to a sufficient level to permit the circuit breakers to be located in the same chamber as the control circuits.

摘要翻译： 描述了一种电子柜，其包含含有发热部件的控制回路和多个断路器。 控制电路和断路器位于机柜内，散热片位于机柜外部的散热烟囱中。 空气通过对流移动通过烟囱，并与散热翅片配合以消散由控制电路的发热部件产生的大部分热量。 在机柜中设有开口，以允许冷却空气通过机柜内部和控制电路部件。 冷却空气的这两条路径配合，以将柜内的温度降至足够的水平，以允许断路器位于与控制回路相同的室内。

公开(公告)号：US4646203A

公开(公告)日：1987-02-24

申请号：US698770

申请日：1985-02-06

申请人： Dat V. Ngo ,  Elliot G. Jacoby

发明人： Dat V. Ngo ,  Elliot G. Jacoby

IPC分类号： H01L23/40 ,  H05K7/20

CPC分类号： H01L23/4006 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2924/0002

摘要： A mounting structure is disclosed for mounting a semiconductor device on a conductive heat sink while electrically insulating the two. A thin, flat thermally conductive electrically insulative sheet is disposed between a flat electrically conductive surface of the semiconductor device and the flat electrically conductive surface of the heat sink which is to receive the semiconductor device. The semiconductor device is fixed to the insulation sheet by a first electrically conductive rivet which compresses the two together. The opening in the insulation sheet through which the rivet passes is enlarged so that no radial forces are applied to the sheet by expansion of the rivet. The rivet head on the bottom of the insulation sheet extends into an enlarged opening in the underlying heat sink but does not touch the opening. The insulation sheet is connected to the heat sink by a second conductive rivet which is laterally displaced from the first, and applies compressive forces between the insulation sheet and heat sink. The opening in the insulation sheet receiving the second rivet is also enlarged so that radial forces cannot be applied from the rivet to the insulation sheet. The insulation sheet is sufficiently rigid so as to hold the full surface of the semiconductor device against the full adjacent surface of the sheet, and to hold the opposite surface of the sheet against the heat sink. The invention is used for mounting of various semiconductor device package styles including the TO-220 outline and the stud mounted outline package.

摘要翻译： 公开了一种用于将半导体器件安装在导电散热器上并将两者电绝缘的安装结构。 半导体器件的平坦导电表面和用于接收半导体器件的散热片的平坦导电表面之间设置有薄的平坦的导热电绝缘片。 半导体器件通过将两者压缩在一起的第一导电铆钉固定到绝缘片。 铆钉通过的绝缘片中的开口被扩大，使得通过铆钉的膨胀不会对片材施加径向力。 绝缘片底部的铆钉头延伸到下面的散热器中的一个扩大的开口，但不接触开口。 绝缘片通过与第一导电铆钉横向移位的第二导电铆钉连接到散热器，并且在绝缘片和散热片之间施加压缩力。 接收第二铆钉的绝缘片中的开口也被扩大，使得不能从铆钉向绝缘片施加径向力。 绝缘片具有足够的刚性，以将半导体器件的整个表面保持抵靠片材的完全相邻的表面，并将片材的相对表面保持抵靠散热片。 本发明用于安装各种半导体器件封装形式，包括TO-220外形和螺柱安装的外形封装。