公开(公告)号：US20240294745A1

公开(公告)日：2024-09-05

申请号：US18193854

申请日：2023-03-31

Applicant: Elite Material Co., Ltd.

Inventor： Yi-Fei YU ,  Ching-Huan LEE ,  Chen-Yu HSIEH

IPC: C08L51/00 ,  C08J5/24

CPC classification number: C08L51/003 ,  C08J5/244 ,  C08J2351/00 ,  C08J2471/12

Abstract: A prepolymer and a resin composition containing the prepolymer are provided. The prepolymer is obtained from a prepolymerization reaction of a mixture, the mixture at least including dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene in a weight ratio of between 1:1 and 5:1. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength, X-axis coefficient of thermal expansion and glass transition temperature.

公开(公告)号：US20230101478A1

公开(公告)日：2023-03-30

申请号：US17504970

申请日：2021-10-19

Applicant: Elite Material Co., Ltd.

Inventor： Yi-Fei YU ,  Ching-Huan LEE ,  Chen-Yu HSIEH

IPC: C08L79/08 ,  C08L71/00 ,  C08J5/24 ,  B32B15/08 ,  B32B15/20 ,  H05K1/03

Abstract: A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.