-
公开(公告)号：US20250059372A1
公开(公告)日：2025-02-20
申请号：US18368712
申请日：2023-09-15
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu HSIEH
Abstract: A resin composition includes a vinyl group-containing resin and a phosphorus-containing compound of Formula (1) or a prepolymer thereof, wherein: relative to 100 parts by weight of the vinyl group-containing resin, the phosphorus-containing compound of Formula (1) is 35 to 60 parts by weight; or relative to 100 parts by weight of the vinyl group-containing resin, the prepolymer of the phosphorus-containing compound of Formula (1) is 50 to 90 parts by weight. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more properties can be improved.
-
公开(公告)号：US20210371656A1
公开(公告)日：2021-12-02
申请号：US16923340
申请日：2020-07-08
Applicant: Elite Material Co., Ltd.
Inventor： Yi-Fei YU , Chien-Hung LEE , Chen-Yu HSIEH
Abstract: A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.
-
公开(公告)号：US20170088669A1
公开(公告)日：2017-03-30
申请号：US15224773
申请日：2016-08-01
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu HSIEH , Tse-An LEE , Hui-Ting SHIH
IPC: C08G65/48 , C08K5/5399 , C08K5/3415 , H05K1/03 , C08K5/14 , C08J5/24 , C09D179/00 , C08L73/00 , C08K3/36
CPC classification number: C08G65/485 , C08J5/24 , C08J2371/12 , C08J2379/00 , C08J2471/12 , C08K3/36 , C08K5/14 , C08K5/3415 , C08K5/5399 , C08L73/00 , C09D179/00 , H05K1/0373 , H05K2201/012
Abstract: The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R′ is R″ is R′″ is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.
-
公开(公告)号：US20160297779A1
公开(公告)日：2016-10-13
申请号：US15072416
申请日：2016-03-17
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu HSIEH , Hui-Ting SHIH
IPC: C07D265/12 , C08F222/08 , C08G73/06 , H05K1/03 , C08K5/5399 , C08K5/03 , C08K5/5313 , C08J5/24 , C07D265/16 , C08K3/36
CPC classification number: C07D265/12 , C07D265/16 , C08F222/08 , C08G73/06 , C08J5/24 , C08J2379/04 , C08L35/06 , H05K1/0373
Abstract: The present disclosure is to provide a modified oxazine compound and use of a composition comprising the same.
Abstract translation: 本公开内容旨在提供修饰的恶嗪化合物和包含其的组合物的用途。
-
公开(公告)号：US20240218152A1
公开(公告)日：2024-07-04
申请号：US18192466
申请日：2023-03-29
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu HSIEH
IPC: C08K5/01 , C08F212/08 , C08F212/36 , C08J5/24 , C08L23/16
CPC classification number: C08K5/01 , C08F212/08 , C08F212/36 , C08J5/24 , C08L23/16 , C08J2323/16 , C08J2325/08 , C08L2203/16 , C08L2203/20
Abstract: A resin composition includes a first compound and a second compound, wherein: the first compound has a structure of Formula (1); the second compound comprises bis(vinylphenyl) ethane, divinylbenzene-ethylstyrene-styrene copolymer, ethylene-propylene-ethylidenenorbornene copolymer or a combination thereof; and a weight ratio of the first compound and the second compound is between 1:5 and 5:1. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including varnish shelf life, temperature coefficient of dielectric constant, dielectric constant and solder floating thermal resistance of multi-layer board.
-
Patent Agency Ranking
公开(公告)号：US20210130610A1
公开(公告)日：2021-05-06
申请号：US16713918
申请日：2019-12-13
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu HSIEH
Abstract: A resin composition includes a vinyl-containing polyphenylene ether resin, a polyolefin and a magnesium and aluminum combination type ionic compound with a thermal resistance of greater than or equal to 600° C. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, copper foil peeling strength, thermal resistance and dissipation factor.
-
公开(公告)号：US20190077914A1
公开(公告)日：2019-03-14
申请号：US15827936
申请日：2017-11-30
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu HSIEH
Abstract: Disclosed is a vinylbenzyl imide resin useful in conjunction with other components to prepare a resin composition for making such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including resin flow, resin filling property, flame retardancy, glass transition temperature, thermal resistance, dielectric constant, dissipation factor and interlayer bonding strength. Also disclosed is a method of preparing the vinylbenzyl imide resin, its prepolymer, a resin composition comprising the vinylbenzyl imide resin and/or its polymer and an article made therefrom.
-
公开(公告)号：US20190016874A1
公开(公告)日：2019-01-17
申请号：US15803433
申请日：2017-11-03
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu HSIEH
Abstract: Disclosed is a resin composition which comprises a compound with at least two DOPO groups or a combination thereof as the flame retardant and an aliphatic long-chain maleimide compound. The resin composition is useful for the preparation of various articles, such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, achieving at least one, more or all properties improved of laminate formability, reliability of multiple laminations, chemical resistance, thermal resistance, dielectric constant, dissipation factor, interlayer bonding strength, storage modulus and so on.
-
公开(公告)号：US20240409742A1
公开(公告)日：2024-12-12
申请号：US18348599
申请日：2023-07-07
Applicant: Elite Material Co., Ltd.
Inventor： Chun-Hung CHEN , Chen-Yu HSIEH
Abstract: A resin composition includes 100 parts by weight of a prepolymer and 150 to 200 parts by weight of a ceramic filler, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes a maleimide resin and a diamine compound in a molar ratio of between 1:2 and 2:1; the ceramic filler has a thermal conductivity of greater than 30 W/(m·K); and the diamine compound includes a compound of Formula (1), a compound of Formula (2), a compound of Formula (3) or a combination thereof. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one or more properties can be improved.
-
公开(公告)号：US20240218094A1
公开(公告)日：2024-07-04
申请号：US18302978
申请日：2023-04-19
Applicant: Elite Material Co., Ltd.
Inventor： Chen-Yu HSIEH
Abstract: A prepolymer and a resin composition containing the prepolymer are provided. The prepolymer is obtained from a prepolymerization reaction of a mixture, the mixture including 100 parts by weight of a compound of Formula (1) and 0.01 to 0.09 part by weight of a Grubbs catalyst. The resin composition may be used to make various articles, including a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength and passive intermodulation.
-
-
-
-
-
-
-
-
-
Search Results
21
records
(took 0.02 seconds)
