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公开(公告)号:US11052399B2
公开(公告)日:2021-07-06
申请号:US15834081
申请日:2017-12-07
发明人: Hui-Ting Shih
摘要: A powder gathering apparatus includes at least two rotating plates and a driving mechanism. The at least two rotating plates are disposed with respect to each other. Each of the rotating plates includes at least one spherical member. The at least one spherical member protrudes from the rotating plate. The driving mechanism drives at least one of the at least two rotating plates to move, such that the at least two rotating plates get close to or away from each other. The driving mechanism drives the at least two rotating plates to rotate.
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公开(公告)号:US20190143335A1
公开(公告)日:2019-05-16
申请号:US15834081
申请日:2017-12-07
发明人: Hui-Ting Shih
摘要: A powder gathering apparatus includes at least two rotating plates and a driving mechanism. The at least two rotating plates are disposed with respect to each other. Each of the rotating plates includes at least one spherical member. The at least one spherical member protrudes from the rotating plate. The driving mechanism drives at least one of the at least two rotating plates to move, such that the at least two rotating plates get close to or away from each other. The driving mechanism drives the at least two rotating plates to rotate.
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公开(公告)号:US10280260B2
公开(公告)日:2019-05-07
申请号:US15224773
申请日:2016-08-01
发明人: Chen-Yu Hsieh , Tse-An Lee , Hui-Ting Shih
IPC分类号: C08J5/24 , C08K3/36 , C08K5/14 , C08L73/00 , C09D179/00 , C08G65/48 , C08K5/3415 , C08K5/5399 , H05K1/03
摘要: The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R′ is R″ is R′″ is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.
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