摘要:
A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.
摘要:
A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes.
摘要:
A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.
摘要:
A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.
摘要:
A halogen-free resin composition includes (A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene. The halogen-free resin composition is characterized by specific ingredients and proportions thereof to achieve circuit board laminate properties, such as a high glass transition temperature, low coefficient of thermal expansion, low dielectric properties, heat resistance, flame retardation, and being halogen-free, and thus is applicable to the manufacturing of a prepreg or resin film, thereby being applicable to the manufacturing of metal laminates and printed circuit boards.
摘要:
A prepolymer is prepared by subjecting a compound of Formula (I) and a vinyl-containing compound to a prepolymerization reaction, and a resin composition includes the prepolymer. The vinyl-containing compound includes bis(vinylphenyl) ethane, divinylbenzene, modification of divinylbenzene or a combination thereof. A ratio in part by weight of the compound of Formula (I) to the vinyl-containing compound in the prepolymerization reaction is 8:2 to 6:4. The resin composition includes the prepolymer and an additive, and an article made from the resin composition may include a resin film, a prepreg, a laminate or a printed circuit board.
摘要:
A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.
摘要:
A phosphazene compound having a vinyl group is manufactured by a reaction between a vinyl compound and a phosphazene compound having a hydroxyl group and added to a resin composition for manufacturing a prepreg or a resin film so as to be applicable to copper-clad laminates and printed circuit boards to thereby achieve satisfactory circuit laminate properties, namely low coefficient of thermal expansion, low dielectric properties, heat resistant, fire resistant, and halogen-free.
摘要:
A phosphorus-containing resin composition comprises a first phosphorus-containing compound, a second phosphorus-containing compound and a maleimide resin; wherein the first phosphorus-containing compound comprises a compound of Formula (I), a compound of Formula (II), or a combination thereof, and wherein the second phosphorus-containing compound is different from the first phosphorus-containing compound, and the second phosphorus-containing compound is absent of a group capable of reacting with the maleimide resin.
摘要:
Disclosed is a resin composition which comprises a compound with at least two DOPO groups or a combination thereof as the flame retardant and an aliphatic long-chain maleimide compound. The resin composition is useful for the preparation of various articles, such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, achieving at least one, more or all properties improved of laminate formability, reliability of multiple laminations, chemical resistance, thermal resistance, dielectric constant, dissipation factor, interlayer bonding strength, storage modulus and so on.