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公开(公告)号：US20240372238A1
公开(公告)日：2024-11-07
申请号：US18628417
申请日：2024-04-05
Applicant: Elve Inc.
Inventor： Blake Griffin , Richard Kowalczyk
Abstract: A circuit device fabricated in device layers, comprises a filter-type circuit fabricated in the device layers; a transmission line fabricated in the device layers and connected to the filter-type circuit; and a corrective mismatch disposed within the transmission line, fabricated in at least one of the device layers, and designed with a corrective impedance to improve matching performance therebetween. A waveguide device fabricated in device layers, comprises a first waveguide fabricated in the device layers and having a first dimension aligned with a first layer; a second waveguide fabricated in the device layers and having a second dimension aligned with a second layer; and a waveguide transformer fabricated in the device layers and having a transformer dimension aligned with a third layer.
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公开(公告)号：US20240371593A1
公开(公告)日：2024-11-07
申请号：US18634127
申请日：2024-04-12
Applicant: Elve Inc.
Inventor： Mikhail Kuffel , Blake Griffin , Danny Chan , Michelle Gonzalez , Diana Gamzina Daugherty , Richard Kowalczyk
Abstract: A method of manufacturing a radio frequency (RF) or electron beam structure, comprises forming each layer of multiple layers to be assembled and bonded together with positional alignment, the forming each layer including forming a first via segment of a first particular shape and dimension in the layer at a first location in the layer, such that when the first via segments of the multiple layers are assembled with positional alignment the multiple first via segments align to form a first via; and inserting a first analogous pin into the first via, the first analogous pin being formed based on the first particular shape and dimension of each of the first via segments, such that inserting the first analogous pin into the first via assists in causing the multiple layers to be assembled with positional alignment.
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