公开(公告)号：US20240097305A1

公开(公告)日：2024-03-21

申请号：US18370174

申请日：2023-09-19

Applicant: Elve Inc.

Inventor： Diana Gamzina Daugherty ,  Mikhail Kuffel ,  Blake Joseph Griffin ,  Richard Kowalczyk

IPC: H01P3/12

CPC classification number: H01P3/12 ,  H01P5/00

Abstract: An electromagnetic waveguide component includes multiple planar layers and one or more layers are shaped to accommodate incoming electromagnetic waves. Each layer includes two more alignment features, and corresponding pins, the two or more alignment features in each of the layers providing precise stacking registration among the plurality of layers, and the planar layers, when assembled into a stack, are configured to provide a desired radio frequency (RF) response.

公开(公告)号：US12176870B2

公开(公告)日：2024-12-24

申请号：US18657220

申请日：2024-05-07

Applicant: Elve Inc.

Inventor： Danny Chan ,  Diana Gamzina Daugherty ,  Richard Kowalczyk ,  Daniel Springmann

IPC: H03F1/00 ,  H03F3/24

Abstract: A power module comprises a high frequency switching electronic power conditioner including stacked rectifier/filters, the stacked rectifier/filters generating stacked DC output voltages; and a vacuum electronic device coupled to the high frequency switching electronic power conditioner, the vacuum electronic device including components, each component receiving a respective DC output voltage of the stacked DC output voltages.

公开(公告)号：US20240372236A1

公开(公告)日：2024-11-07

申请号：US18653646

申请日：2024-05-02

Applicant: Elve Inc.

Inventor： Mikhail Kuffel ,  Danny Chan ,  Michelle Gonzalez ,  Diana Gamzina Daugherty ,  Richard Kowalczyk

IPC: H01P1/08 ,  H01P3/127

Abstract: A radio-frequency (RF) window comprises a first flange assembly including a first flange having a first flange thickness between a first surface and a second surface, and a first waveguide channel; and a first window element having a first window thickness and disposed in the first waveguide channel at a first location; and a second flange assembly stacked against the first flange assembly, the second flange assembly including a second flange having a second flange thickness between a third surface and a fourth surface, and a second waveguide channel; and a second window element having a second window thickness and disposed in the second waveguide channel at a second location, such that when the first flange assembly is stacked against the second flange assembly the second window element has a predetermined distance to the first window element, the predetermined distance selected based on a desired frequency band of operations.

公开(公告)号：US20240371593A1

公开(公告)日：2024-11-07

申请号：US18634127

申请日：2024-04-12

Applicant: Elve Inc.

Inventor： Mikhail Kuffel ,  Blake Griffin ,  Danny Chan ,  Michelle Gonzalez ,  Diana Gamzina Daugherty ,  Richard Kowalczyk

IPC: H01J9/00 ,  B33Y80/00 ,  H01J25/34

Abstract: A method of manufacturing a radio frequency (RF) or electron beam structure, comprises forming each layer of multiple layers to be assembled and bonded together with positional alignment, the forming each layer including forming a first via segment of a first particular shape and dimension in the layer at a first location in the layer, such that when the first via segments of the multiple layers are assembled with positional alignment the multiple first via segments align to form a first via; and inserting a first analogous pin into the first via, the first analogous pin being formed based on the first particular shape and dimension of each of the first via segments, such that inserting the first analogous pin into the first via assists in causing the multiple layers to be assembled with positional alignment.

公开(公告)号：US20240372516A1

公开(公告)日：2024-11-07

申请号：US18657220

申请日：2024-05-07

Applicant: Elve Inc.

Inventor： Danny Chan ,  Diana Gamzina Daugherty ,  Richard Kowalczyk ,  Daniel Springmann

IPC: H03F3/24

Abstract: A power module comprises a high frequency switching electronic power conditioner including stacked rectifier/filters, the stacked rectifier/filters generating stacked DC output voltages; and a vacuum electronic device coupled to the high frequency switching electronic power conditioner, the vacuum electronic device including components, each component receiving a respective DC output voltage of the stacked DC output voltages.

公开(公告)号：US20240372238A1

公开(公告)日：2024-11-07

申请号：US18628417

申请日：2024-04-05

Applicant: Elve Inc.

Inventor： Blake Griffin ,  Richard Kowalczyk

IPC: H01P1/20 ,  H01P3/00

Abstract: A circuit device fabricated in device layers, comprises a filter-type circuit fabricated in the device layers; a transmission line fabricated in the device layers and connected to the filter-type circuit; and a corrective mismatch disposed within the transmission line, fabricated in at least one of the device layers, and designed with a corrective impedance to improve matching performance therebetween. A waveguide device fabricated in device layers, comprises a first waveguide fabricated in the device layers and having a first dimension aligned with a first layer; a second waveguide fabricated in the device layers and having a second dimension aligned with a second layer; and a waveguide transformer fabricated in the device layers and having a transformer dimension aligned with a third layer.