-
1.
公开(公告)号:US5456610A
公开(公告)日:1995-10-10
申请号:US122205
申请日:1993-09-16
IPC分类号: G06K17/00 , G06K13/08 , H01R12/18 , H01R13/633 , H01R13/62
CPC分类号: G06K13/0806 , G06K13/08 , H01R13/633
摘要: An improved ejector mechanism is disclosed in conjunction with a header connector into which an IC pack is loaded and from which it is ejected. The IC pack includes a shell having a vertically extending leading face and at least one row of contacts extending a horizontal distance defining a contact array. A unitary ejecting lever is pivotally mounted to the header connector, with one end of the lever being effective to engage and eject the IC pack from the header connector. A unitary push-rod is reciprocally axially movably mounted on an appropriate support at one side of the header connector. One end of the push rod is engageable with the opposite end of the ejecting lever for pivoting the lever in response to movement of the push-rod. The one end of the ejecting lever engages and ejects the IC pack along a leading face thereof in an area defined horizontally by the distance the row of contacts extends and vertically by the height of the leading face of the memory card.
摘要翻译: 公开了一种改进的喷射器机构,其结合具有IC组件的头部连接器,并将其从其中喷出。 IC封装包括具有垂直延伸的前表面的外壳和至少一排延伸定义接触阵列的水平距离的触点。 一体式排出杆枢转地安装到集管连接器上,杆的一端有效地从集管连接器接合和排出IC组件。 单个推杆可往复地轴向移动地安装在头部连接器一侧的适当的支撑件上。 推杆的一端可与弹出杆的相对端接合,以响应于推杆的移动来枢转杠杆。 弹出杆的一端沿着其前端面在与水平方向限定的区域中接合并排出IC封装,该距离是触点延伸的距离,垂直地延伸存储卡的前端的高度。