摘要:
An improved ejector mechanism is disclosed in conjunction with a header connector into which an IC pack is loaded and from which it is ejected. The IC pack includes a shell having a vertically extending leading face and at least one row of contacts extending a horizontal distance defining a contact array. A unitary ejecting lever is pivotally mounted to the header connector, with one end of the lever being effective to engage and eject the IC pack from the header connector. A unitary push-rod is reciprocally axially movably mounted on an appropriate support at one side of the header connector. One end of the push rod is engageable with the opposite end of the ejecting lever for pivoting the lever in response to movement of the push-rod. The one end of the ejecting lever engages and ejects the IC pack along a leading face thereof in an area defined horizontally by the distance the row of contacts extends and vertically by the height of the leading face of the memory card.
摘要:
A grounding system is provided for a card-receiving header connector assembly. The header connector assembly includes a header connector mounted on a printed circuit board for receiving an IC card. The IC card includes a receptacle connector and a receptacle shield. A plurality of terminals are mounted within the header connector and are adapted for mating to terminals of the receptacle connector of the IC card. A grounding shroud is mounted on the header connector and includes a main body plate and a plurality of ground contact portions formed therein for engaging corresponding contacts on the receptacle shield of the IC card. The ground contact portions each are formed by a generally C-shaped spring arm having opposite ends joined to the main body plate of the shroud, with a portion of the spring arm between the ends being formed downwardly for asymmetrically engaging the contacts on the receptacle shield of the IC card.
摘要:
A memory card which includes a circuit substrate having a generally planar surface, comprises a frame with an opening in one of a top or a bottom wall thereof for receiving the circuit substrate. A support structure on the frame supports the circuit substrate within the card. A cover closes the opening and encloses the circuit substrate and the electrical component within the internal card space created by the frame and cover. The support structure of the frame includes a plurality of shelves at different vertical locations within the frame to support the circuit substrate at different vertical levels to accommodate varying heights of electrical components mounted on one or both surfaces of the substrate. The circuit substrate includes a peripheral edge area with cutouts corresponding to only one of the shelves whereby only the periphery of the substrate need be modified for locating and supporting the circuit substrate at different levels within the card.
摘要:
A method is provided for fabricating a receptacle connector for use in an IC card assembly wherein the receptacle connector is adapted for mounting generally at an edge of a circuit substrate. A housing is provided with an upper surface and a plurality of terminal-receiving passages in a dual row configuration extend parallel to the upper surface. The circuit substrate is adapted to be located a given vertical distance from the upper surface of the housing. A plurality of receptacle terminals are inserted into the passages with surface mount tail portions of the terminals projecting outside the passages. The vertical distance between the circuit substrate and the top of the housing is determined. The tail portions of the two rows of terminals initially project in a generally straight planar array from a rear face of the housing. In a single final forming step, the surface mount tail portions are formed into coplanar curved contact portions such that the contact portions of the surface mount tail portions will engage a corresponding single row contact pad array on the edge of the circuit substrate when the receptacle connector is mounted generally thereon.
摘要:
An IC card includes a generally rectangular frame. A circuit board assembly is mounted on the frame, with the circuit board assembly including a generally planar dielectric substrate having circuit traces and at least one electrical component mounted thereon. A receptacle connector including terminals is mounted at an edge of the circuit board assembly, with the terminals being adapted to mechanically and electrically engage the circuit traces on the circuit board assembly. Complementary interengaging latches are provided between the frame and the receptable connector for securing the receptacle connector at the edge of the circuit board assembly and for ensuring a mechanical and electrical connection between the terminals and the circuit traces on the circuit board assembly. The invention also contemplates a method of fabricating the IC card according to the above.
摘要:
A universal grounding clip is provided for a card-receiving connector which is mounted on a printed circuit board. The connector includes a generally U-shaped housing having guide arms adapted to guide the outside edges of a PC card into mating engagement with the connector. The PC card includes grounding contacts along the outside edges of the card. The universal grounding clip is mounted on each guide arm and includes a contact portion on an inside surface of the respective guide arm for engaging the corresponding grounding contact at the edge of the PC card during insertion of the card and discharging static electricity from the card prior to complete mating of the card and connector. A grounding pad on the grounding clip is provided along a bottom surface of the respective arm and is adapted to be electrically coupled to a ground circuit on the printed circuit board. A grounding pad is also provided along a top surface of the arm for engaging a bottom ground portion of a top stacked connector. The grounding pads of the grounding clip are cut-away to allow a fastening device to pass through the guide arm and to fit within a recess in the guide arm so as not to extend beyond the upper surface thereof.
摘要:
An electrical connector is provided for surface mounting on a printed circuit board and includes a dielectric housing having a mating face and a surface mounting face. The mating face includes a mating cavity. The surface mounting face includes a terminal-receiving passageway communicating with the cavity. A terminal is mounted on the housing, the terminal being stamped and formed of sheet metal material in a T-shaped configuration defining a trunk portion and a cross portion. The trunk portion extends through the passageway and projects into the mating cavity of the housing to provide a male terminal pin therein. The cross portion is exposed at the surface mounting face of the housing for contacting a circuit trace on the printed circuit board.
摘要:
A board-mountable connector is provided. The connector includes a shield and an insulative housing with a tongue. Terminals are supported by the housing in two rows and the rows extend from a mating interface to a board mounting interface. The terminals may be mounted to the board via surface mount technology in two rows that are at about 0.4 mm pitch. The two rows of terminals are configured in a signal, signal, ground triangular configuration so as to provide a triangular terminal arrangement that extends from the mating interface to the mounting interface.
摘要:
A connector assembly is provided with opposing and interengageable first and second connector components. Each of the two components preferably includes upper and lower housing formed from an insulative material coated with electrically-conductive material, with cavities formed therein that receive terminal assemblies. The upper and lower housings are formed with internal cavities that extend in orthogonal directions. Each cavity contains a terminal assembly of either plug or receptacle structure and may further include either a plurality of power terminals or differential signal terminals. The terminals have contact portions, tail portions and interconnecting portions that are partially encapsulated by an insulative outer shell. In assembling the first and second components, multiple ground connections are made in sequence before any signal or power supply connections are made. In disassembling the components, signals and power supply connections are broken first, then the ground connections are broken in a sequence that is the reverse of what was made during assembly.
摘要:
A connector assembly for connecting to differential signal circuits on at least one circuit board may be of the docking type or the interposer type. A housing of the connector has transversely and longitudinally extending walls that define a plurality of cavities that extend completely through the housing. Terminal assemblies with at least one differential signal pair are received in the cavities with tail portions on at least one end of the differential pairs to connect to a circuit board. The connector housing has conductive surfaces and a plurality of ground terminal members are disposed along the transverse walls or the longitudinal walls, or both, for connecting to ground circuits in the circuit board. The ground terminal members each have a plurality of ground terminals, which are disposed along the walls at intermediate or diagonal positions relative to the differential signal pairs, such as adjacent to four differential signal pairs. Such placement of the ground terminal members also subdivides the differential signal pairs into groups or sets. This interstitial ground terminal arrangement also serves to keep the impedance at the connector-circuit board interface relatively uniform for high speed signals in the differential pairs.