Forming three dimensional isolation structures
    1.
    发明授权
    Forming three dimensional isolation structures 有权
    形成三维隔离结构

    公开(公告)号:US08932935B2

    公开(公告)日:2015-01-13

    申请号:US12952240

    申请日:2010-11-23

    IPC分类号: H01L21/31 H01L21/762

    CPC分类号: H01L29/0649 H01L21/76224

    摘要: A three dimensional shallow trench isolation structure including sets of parallel trenches extending in two perpendicular directions may be formed by depositing a conformal deposition in a first set of parallel trenches, oxidizing the second set of trenches to enable selective deposition in said second set of trenches and then conformally depositing in said second set of trenches. In some embodiments, only one wet anneal, one etch back, and one high density plasma chemical vapor deposition step may be used to fill both sets of trenches.

    摘要翻译: 包括在两个垂直方向上延伸的并联沟槽组的三维浅沟槽隔离结构可以通过在第一组平行沟槽中沉积共形沉积而形成,氧化第二组沟槽以使得能够选择性地沉积在所述第二组沟槽中, 然后共形地沉积在所述第二组沟槽中。 在一些实施例中,可以仅使用一个湿法退火,一次回蚀和一个高密度等离子体化学气相沉积步骤来填充两组沟槽。

    Forming Three Dimensional Isolation Structures
    2.
    发明申请
    Forming Three Dimensional Isolation Structures 有权
    形成三维隔离结构

    公开(公告)号:US20120126374A1

    公开(公告)日:2012-05-24

    申请号:US12952240

    申请日:2010-11-23

    IPC分类号: H01L29/66 H01L21/31

    CPC分类号: H01L29/0649 H01L21/76224

    摘要: A three dimensional shallow trench isolation structure including sets of parallel trenches extending in two perpendicular directions may be formed by depositing a conformal deposition in a first set of parallel trenches, oxidizing the second set of trenches to enable selective deposition in said second set of trenches and then conformally depositing in said second set of trenches. In some embodiments, only one wet anneal, one etch back, and one high density plasma chemical vapor deposition step may be used to fill both sets of trenches.

    摘要翻译: 包括在两个垂直方向上延伸的并联沟槽组的三维浅沟槽隔离结构可以通过在第一组平行沟槽中沉积共形沉积而形成,氧化第二组沟槽以使得能够选择性地沉积在所述第二组沟槽中, 然后共形地沉积在所述第二组沟槽中。 在一些实施例中,可以仅使用一个湿法退火,一次回蚀和一个高密度等离子体化学气相沉积步骤来填充两组沟槽。