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公开(公告)号:US08932935B2
公开(公告)日:2015-01-13
申请号:US12952240
申请日:2010-11-23
申请人: Enzo Carollo , Marcello Mariani , Sara Marelli , Luca Di Piazza
发明人: Enzo Carollo , Marcello Mariani , Sara Marelli , Luca Di Piazza
IPC分类号: H01L21/31 , H01L21/762
CPC分类号: H01L29/0649 , H01L21/76224
摘要: A three dimensional shallow trench isolation structure including sets of parallel trenches extending in two perpendicular directions may be formed by depositing a conformal deposition in a first set of parallel trenches, oxidizing the second set of trenches to enable selective deposition in said second set of trenches and then conformally depositing in said second set of trenches. In some embodiments, only one wet anneal, one etch back, and one high density plasma chemical vapor deposition step may be used to fill both sets of trenches.
摘要翻译: 包括在两个垂直方向上延伸的并联沟槽组的三维浅沟槽隔离结构可以通过在第一组平行沟槽中沉积共形沉积而形成,氧化第二组沟槽以使得能够选择性地沉积在所述第二组沟槽中, 然后共形地沉积在所述第二组沟槽中。 在一些实施例中,可以仅使用一个湿法退火,一次回蚀和一个高密度等离子体化学气相沉积步骤来填充两组沟槽。
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公开(公告)号:US20120126374A1
公开(公告)日:2012-05-24
申请号:US12952240
申请日:2010-11-23
申请人: Enzo Carollo , Marcello Mariani , Sara Marelli , Luca Di Piazza
发明人: Enzo Carollo , Marcello Mariani , Sara Marelli , Luca Di Piazza
CPC分类号: H01L29/0649 , H01L21/76224
摘要: A three dimensional shallow trench isolation structure including sets of parallel trenches extending in two perpendicular directions may be formed by depositing a conformal deposition in a first set of parallel trenches, oxidizing the second set of trenches to enable selective deposition in said second set of trenches and then conformally depositing in said second set of trenches. In some embodiments, only one wet anneal, one etch back, and one high density plasma chemical vapor deposition step may be used to fill both sets of trenches.
摘要翻译: 包括在两个垂直方向上延伸的并联沟槽组的三维浅沟槽隔离结构可以通过在第一组平行沟槽中沉积共形沉积而形成,氧化第二组沟槽以使得能够选择性地沉积在所述第二组沟槽中, 然后共形地沉积在所述第二组沟槽中。 在一些实施例中,可以仅使用一个湿法退火,一次回蚀和一个高密度等离子体化学气相沉积步骤来填充两组沟槽。
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