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公开(公告)号:US20090116252A1
公开(公告)日:2009-05-07
申请号:US12299812
申请日:2007-04-06
申请人: Eric J. Kille , Ron Steen , Ernie Combs , Timothy B. Moss , Bernd Clauberg
发明人: Eric J. Kille , Ron Steen , Ernie Combs , Timothy B. Moss , Bernd Clauberg
IPC分类号: F21V29/00
CPC分类号: H05K1/0204 , H05K1/021 , H05K1/182 , H05K3/0061 , H05K2201/09054 , H05K2201/10106
摘要: A LED package employs a heatsink (30), a LED (10) thermally mounted to the heatsink (30), and a printed circuit board (20) including a hole (21) extending there through for facilitating the thermal surface mounting of the LED (10) onto the heatsink (30). The printed circuit board (20) is preferably surface mounted onto the heatsink (30). The LED (10) is seated within the hole (21) and includes leads (11, 12) electrically coupled to the printed circuit board (10) wherein a portion of each lead (11, 12) is partially seated within the hole (21), and/or the heatsink (30) includes a post (31) seated within the hole (21) and the LED is thermally mounted to the post (31).
摘要翻译: LED封装采用散热器(30),热安装到散热器(30)的LED(10)和包括在其中延伸的孔(21)的印刷电路板(20),以便于LED的热表面安装 (10)到散热器(30)上。 印刷电路板(20)优选地被表面安装到散热器(30)上。 LED(10)位于孔(21)内并且包括电耦合到印刷电路板(10)的引线(11,12),其中每个引线(11,12)的一部分部分地位于孔(21)内 )和/或散热器(30)包括位于孔(21)内的柱(31),并且LED热安装到柱(31)。