公开(公告)号：US06716093B2

公开(公告)日：2004-04-06

申请号：US10013429

申请日：2001-12-07

申请人： Erik H. Engdahl ,  Michael D. Steiman ,  Paul H. Stasiewicz, Jr.

发明人： Erik H. Engdahl ,  Michael D. Steiman ,  Paul H. Stasiewicz, Jr.

IPC分类号： B24B700

CPC分类号： B24B37/27 ,  B24B37/30

摘要： An assembly for holding a substrate in a chemical mechanical planarization (CMP) apparatus is provided. The assembly includes a holder frame insertable into the chemical mechanical planarization apparatus, the holder frame having an inner wall. The assembly further includes at least one rolling mechanism rotatably mounted in the holder frame such that at least a portion of the rolling mechanism protrudes from the inner wall. The assembly also includes a wafer chuck movably mounted in the holder frame, the wafer chuck having a first side shaped to substantially conform to the inner wall and to be in continuous contact with the at least one rolling mechanism during planarization, and a second side adapted to receive a substrate for planarization. Also provided are an improved assembly for holding a substrate in a CMP apparatus and a method for reducing friction in a gimbaling mechanism of a wafer chuck in a wafer holder in a CMP apparatus during planarization.

摘要翻译： 提供了一种用于在化学机械平面化（CMP）装置中保持基板的组件。 该组件包括可插入到化学机械平面化装置中的保持架，所述保持架具有内壁。 组件还包括至少一个可旋转地安装在保持架框架中的滚动机构，使得滚动机构的至少一部分从内壁突出。 组件还包括可移动地安装在保持器框架中的晶片夹具，晶片卡盘具有成形为基本上符合内壁并且在平坦化期间与至少一个滚动机构连续接触的第一侧，并且第二侧适配 以接收用于平坦化的衬底。 还提供了一种用于在CMP设备中保持基板的改进的组件以及用于在平坦化期间在CMP设备中的晶片保持器中的用于减小晶片卡盘的万向节机构中的摩擦力的方法。