利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

74 条记录 (耗时 0.019 秒)

    WAFER EDGE ASYMMETRY CORRECTION USING GROOVE IN POLISHING PAD
    2.
    发明公开
    WAFER EDGE ASYMMETRY CORRECTION USING GROOVE IN POLISHING PAD 审中-公开

    公开(公告)号：US20240075583A1

    公开(公告)日：2024-03-07

    申请号：US18505871

    申请日：2023-11-09

    申请人： Applied Materials, Inc.

    发明人： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep

    IPC分类号： B24B37/26 ,  B24B37/005 ,  B24B37/04 ,  B24B37/27

    CPC分类号： B24B37/26 ,  B24B37/005 ,  B24B37/042 ,  B24B37/27

    摘要： A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.

    Automatic handling apparatus with positioning pins
    4.
    发明授权
    Automatic handling apparatus with positioning pins 有权

    公开(公告)号：US09931730B2

    公开(公告)日：2018-04-03

    申请号：US15314982

    申请日：2015-05-13

    申请人： SHIN-ETSU HANDOTAI CO., LTD.

    发明人： Taichi Yasuda ,  Tatsuo Enomoto

    IPC分类号： H01L21/683 ,  B24B37/27 ,  H01L21/68 ,  H01L21/02 ,  B25J15/06 ,  B25J9/04 ,  B25J9/10

    CPC分类号： B24B37/27 ,  B24B37/28 ,  B24B41/005 ,  B25J9/042 ,  B25J9/102 ,  B25J15/0616 ,  H01L21/02 ,  H01L21/68 ,  H01L21/6838

    摘要： Automatic handling apparatus having a suction-head sucking and holding a workpiece, an arm is connected to and moves the suction-head, and a stage on which the workpiece to be carried to the carrier holding hole is mounted, the suction-head has a movable section which is movable within a parallel plane to the suction-head body, the movable section to suck and hold the workpiece, and has positioning pins stretched in vertically lower direction and, at loading time, the workpiece held by the movable section into the carrier holding hole, the positioning pins are appressed against tooth-bottoms of a gear on the carrier outer periphery and movable section moving within the parallel plane. The carrier is pushed against the sun gear side to fix the carrier position and direction, and the held workpiece is carried into the holding hole. Consequently, the automatic handling apparatus load the workpiece into the carrier holding hole.

    Polishing apparatus, polishing method and pressing member for pressing a polishing tool
    5.
    发明授权
    Polishing apparatus, polishing method and pressing member for pressing a polishing tool 有权
    抛光装置，抛光方法和用于按压抛光工具的按压构件

    公开(公告)号：US09199352B2

    公开(公告)日：2015-12-01

    申请号：US12986481

    申请日：2011-01-07

    申请人： Masaya Seki ,  Kenya Ito ,  Masayuki Nakanishi

    发明人： Masaya Seki ,  Kenya Ito ,  Masayuki Nakanishi

    IPC分类号： B24B9/00 ,  B24B9/06 ,  B24B21/00 ,  B24B37/27

    CPC分类号： B24B9/065 ,  B24B21/004 ,  B24B37/27

    摘要： A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and to rotate the substrate and at least one polishing head disposed near the peripheral portion of the substrate. The polishing head has at least one protrusion extending along a circumferential direction of the substrate, and the polishing head is configured to press a polishing surface of a polishing tape by the protrusion against the peripheral portion of the substrate from above or below.

    摘要翻译： 抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。 抛光装置包括旋转保持机构，其构造成水平地保持基板并旋转基板和设置在基板的周边部分附近的至少一个抛光头。 抛光头具有沿着基板周向延伸的至少一个突出部，并且抛光头构造成通过突起抵靠基板的周边部分从上方或下方按压抛光带的抛光表面。

    HOLDER FOR POLISHED WORK, AND LAMINATE PLATE USED FOR SAME
    6.
    发明申请
    HOLDER FOR POLISHED WORK, AND LAMINATE PLATE USED FOR SAME 审中-公开
    用于抛光工作的夹具和用于同一工艺的层压板

    公开(公告)号：US20150050868A1

    公开(公告)日：2015-02-19

    申请号：US14385849

    申请日：2013-03-21

    申请人： SUMITOMO BAKELITE CO., LTD.

    发明人： Mitsuo Taketani ,  Toyotaro Maruyama

    IPC分类号： B24B37/27

    CPC分类号： B24B37/27 ,  B24B37/28 ,  B24B41/06 ,  Y10T442/2992

    摘要： The invention provides a holder for a polished work in which the warpage suppression or plate thickness accuracy of the holder for a polished work is improved, the generation of scratches in a polished work is suppressed so as to improve the abrasion resistance, and furthermore, economic advantages are provided. The holder for a polished work of the invention includes a first resin layer produced by impregnating a first resin composition into a first fiber base material, and heating and pressurizing the first fiber base material as an outermost layer, the first fiber base material is a glass fiber base material, and a structure derived from a resin having a novolac skeleton is included in a proportion of 50 mass % or more in the first resin layer excluding the first fiber base material.

    摘要翻译： 本发明提供了一种用于抛光工件的保持器，其中提高了用于抛光工件的保持器的翘曲抑制或板厚度精度，抑制了抛光工件中的划痕的产生以提高耐磨性，此外，经济 提供优点。 本发明的抛光用具的保持具包括通过将第一树脂组合物浸渍到第一纤维基材中而制成的第一树脂层，对作为最外层的第一纤维基材进行加热加压，第一纤维基材为玻璃 纤维基材和来自具有酚醛清漆骨架的树脂的结构在除第一纤维基材以外的第一树脂层中的比例为50质量％以上。

    RETAINER RING
    7.
    发明申请
    RETAINER RING 有权
    保持环

    公开(公告)号：US20130316620A1

    公开(公告)日：2013-11-28

    申请号：US13479295

    申请日：2012-05-24

    申请人： André Loebmann ,  Norman Nagel

    发明人： André Loebmann ,  Norman Nagel

    IPC分类号： H01L21/683

    CPC分类号： B24B37/10 ,  B24B7/228 ,  B24B37/042 ,  B24B37/27 ,  B24B37/32

    摘要： A retainer ring is provided for use in conjunction with Chemical Mechanical Polishing apparatus which polishing is used to polish a substrate. Particularly, the retainer ring includes an inner surface defining a retainer area, an outer surface, a front surface extending between the inner and outer surface, the front surface being in contact with the polishing pad during polishing and a transition region between the outer surface and the front surface. A CMP apparatus which includes at least a ring having the above features is also provided for.

    摘要翻译： 提供了一种用于与化学机械抛光设备结合使用的保持环，抛光用于抛光基底。 特别地，保持环包括限定保持器区域的内表面，外表面，在内表面和外表面之间延伸的前表面，前表面在抛光期间与抛光垫接触，并且在外表面和外表面之间的过渡区域 前面。 还提供了包括至少具有上述特征的环的CMP装置。