公开(公告)号：US20120305393A1

公开(公告)日：2012-12-06

申请号：US13577782

申请日：2011-02-16

申请人： Eugene Y. Ivanov ,  Alexander Leybovich ,  John Rizer

发明人： Eugene Y. Ivanov ,  Alexander Leybovich ,  John Rizer

IPC分类号： C23C14/34 ,  C23C14/14 ,  B23P11/00 ,  B05D5/12

CPC分类号： C23C14/3407 ,  H01J37/3423 ,  H01J37/3426 ,  H01J37/3435 ,  Y10T29/49826

摘要： In one aspect of the invention, a sputter target is provided comprising a backing plate (40) comprising a front surface and a back surface; and a sputtering plate mounted on said backing plate, the sputtering plate comprising a sputtering surface and a back surface. At least one of the back surface of the sputtering plate, the front surface of the backing plate, or the back surface of the backing plate has at least one groove (30) that is shaped and sized to correspond to an observed region of higher sputtering of the sputtering plate relative to an adjacent area of the sputtering plate. An insert (50) is placed in the groove(s). The backing plate comprises a first material, the sputtering plate comprises a second material, and an insert comprises a third material. In yet another aspect of the sputter target, a method of controlling the electromagnetic properties of a sputter target is provided.

摘要翻译： 在本发明的一个方面，提供一种溅射靶，其包括一个包括前表面和后表面的背板（40） 以及安装在所述背板上的溅射板，所述溅射板包括溅射表面和背面。 溅射板的后表面，背板的前表面或背板的后表面中的至少一个具有至少一个凹槽（30），其形状和尺寸被设计成对应于较高溅射的观察区域 的溅射板相对于溅射板的相邻区域。 插入件（50）放置在凹槽中。 背板包括第一材料，溅射板包括第二材料，并且插入件包括第三材料。 在溅射靶的另一方面，提供了一种控制溅射靶的电磁特性的方法。