摘要:
A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.
摘要:
A duplex scanning apparatus includes a scan case including a platen glass, a first scanning module disposed inside the scan case, a scanning module moving unit that is disposed inside the scan case perpendicular to the first scanning module and guides a movement of the first scanning module, and an automatic document feeding apparatus disposed on a top side of the scan case to cover the platen glass including a feeding frame in which a document moving route is formed, a scanning module opening formed on an upper side of the document moving route in the feeding frame, a second scanning module disposed in the scanning module opening, and a scanning module adjusting unit formed to rotate the second scanning module at a predetermined angle based on a point of the feeding frame with respect to the scanning module opening.