公开(公告)号：US20070112927A1

公开(公告)日：2007-05-17

申请号：US11559598

申请日：2006-11-14

申请人： Eun-Young JUNG

发明人： Eun-Young JUNG

IPC分类号： G06F15/16

CPC分类号： H04L51/063 ,  G06Q10/107

摘要： An apparatus for transmitting a message includes a message generator in which a data structure is generated. The data structure includes a plurality of address fields. Each address field includes at least one message recipient address. The message generator generates a message which includes a common message field and a hidden message field. The apparatus also includes a controller which controls transmission of the generated message to message recipient addresses entered into the plurality of address fields.

摘要翻译： 用于发送消息的装置包括其中生成数据结构的消息生成器。 数据结构包括多个地址字段。 每个地址字段包括至少一个消息收件人地址。 消息生成器生成包含公共消息字段和隐藏消息字段的消息。 该设备还包括控制器，其控制所生成的消息到输入到多个地址字段中的消息接收者地址的传输。

公开(公告)号：US20120225150A1

公开(公告)日：2012-09-06

申请号：US13411025

申请日：2012-03-02

申请人： Dong-Chul HAN ,  Sang-Geun KIM ,  Jeong-Hoon KIM ,  Eun-Young JUNG ,  Yo-Se EUM ,  Ho-Soo JANG

发明人： Dong-Chul HAN ,  Sang-Geun KIM ,  Jeong-Hoon KIM ,  Eun-Young JUNG ,  Yo-Se EUM ,  Ho-Soo JANG

IPC分类号： B29C45/02

CPC分类号： B29C45/02 ,  B29C45/14655 ,  B29C45/32 ,  H01L21/67126 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/00

摘要： A molding apparatus for semiconductor package includes: a lower mold supporting a first semiconductor chip; a middle mold positioned over the lower mold and supporting a second semiconductor chip, and having a first cavity for molding the first semiconductor chip on a lower surface facing the lower mold; an upper mold positioned over the middle mold and having a second cavity for molding the second semiconductor chip on a lower surface facing the middle mold; a first supply port penetrating the lower mold and connected to the first cavity; a second supply port penetrating the lower and middle molds and connected to the second cavity; and a pressure unit positioned under the lower mold and including first and second transfer rams provided respectively in the first and second supply ports to pressure molding compound therein to supply the molding compound into the first and second cavities.

摘要翻译： 一种用于半导体封装的成型装置，包括：支撑第一半导体芯片的下模; 中间模具，其位于所述下模具上方并支撑第二半导体芯片，并且具有用于在面向所述下模具的下表面上模制所述第一半导体芯片的第一腔体; 上模具定位在中间模具上方，并具有用于在面向中间模具的下表面上模制第二半导体芯片的第二腔体; 第一供应口穿透下模并连接到第一腔; 第二供应口穿透下模和中模并连接到第二腔; 以及压力单元，其位于所述下模具下方，并且包括分别设置在所述第一和第二供应端口中的第一和第二转印柱，以将所述模塑料供应到所述第一和第二空腔中。