Method of fabricating CMOS transistor that prevents gate thinning
    1.
    发明授权
    Method of fabricating CMOS transistor that prevents gate thinning 有权
    制造防止栅极薄化的CMOS晶体管的方法

    公开(公告)号:US07268029B2

    公开(公告)日:2007-09-11

    申请号:US10994042

    申请日:2004-11-19

    IPC分类号: H01L21/8238

    摘要: Provided is a method of fabricating a CMOS transistor in which, after a polysilicon layer used as a gate is formed on a semiconductor substrate, a photoresist pattern that exposes an n-MOS transistor region is formed on the polysilicon layer. An impurity is implanted in the polysilicon layer of the n-MOS transistor region using the photoresist pattern as a mask, and the photoresist pattern is removed. If the polysilicon layer of the n-MOS transistor region is damaged by the implanting of the impurity, the polysilicon layer of the n-MOS transistor region is annealed, and a p-MOS transistor gate and an n-MOS transistor gate are formed by patterning the polysilicon layer. The semiconductor substrate, the p-MOS transistor gate and the n-MOS transistor gate is cleaned with a hydrofluoric acid (HF) solution, without causing a decrease in height of the n-MOS transistor gate.

    摘要翻译: 提供一种制造CMOS晶体管的方法,其中在半导体衬底上形成用作栅极的多晶硅层之后,在多晶硅层上形成曝光n-MOS晶体管区的光刻胶图案。 使用光致抗蚀剂图案作为掩模,在n-MOS晶体管区域的多晶硅层中注入杂质,除去光致抗蚀剂图案。 如果n-MOS晶体管区域的多晶硅层通过注入杂质而损坏,则n-MOS晶体管区域的多晶硅层退火,并且p-MOS晶体管栅极和n-MOS晶体管栅极由 构图多晶硅层。 用氢氟酸(HF)溶液清洗半导体衬底,p-MOS晶体管栅极和n-MOS晶体管栅极,而不会降低n-MOS晶体管栅极的高度。

    Method of fabricating CMOS transistor that prevents gate thinning
    2.
    发明申请
    Method of fabricating CMOS transistor that prevents gate thinning 有权
    制造防止栅极薄化的CMOS晶体管的方法

    公开(公告)号:US20050112814A1

    公开(公告)日:2005-05-26

    申请号:US10994042

    申请日:2004-11-19

    摘要: Provided is a method of fabricating a CMOS transistor in which, after a polysilicon layer used as a gate is formed on a semiconductor substrate, a photoresist pattern that exposes an n-MOS transistor region is formed on the polysilicon layer. An impurity is implanted in the polysilicon layer of the n-MOS transistor region using the photoresist pattern as a mask, and the photoresist pattern is removed. If the polysilicon layer of the n-MOS transistor region is damaged by the implanting of the impurity, the polysilicon layer of the n-MOS transistor region is annealed, and a p-MOS transistor gate and an n-MOS transistor gate are formed by patterning the polysilicon layer. The semiconductor substrate, the p-MOS transistor gate and the n-MOS transistor gate is cleaned with a hydrofluoric acid (HF) solution, without causing a decrease in height of the n-MOS transistor gate.

    摘要翻译: 提供一种制造CMOS晶体管的方法,其中在半导体衬底上形成用作栅极的多晶硅层之后,在多晶硅层上形成曝光n-MOS晶体管区的光刻胶图案。 使用光致抗蚀剂图案作为掩模,在n-MOS晶体管区域的多晶硅层中注入杂质,除去光致抗蚀剂图案。 如果n-MOS晶体管区域的多晶硅层通过注入杂质而损坏,则n-MOS晶体管区域的多晶硅层退火,并且p-MOS晶体管栅极和n-MOS晶体管栅极由 构图多晶硅层。 用氢氟酸(HF)溶液清洗半导体衬底,p-MOS晶体管栅极和n-MOS晶体管栅极,而不会降低n-MOS晶体管栅极的高度。