公开(公告)号：US11790552B2

公开(公告)日：2023-10-17

申请号：US17476997

申请日：2021-09-16

申请人： FINE SEMITECH CORP.

发明人： Sung Chul Jeon ,  Dong Young Shin ,  Sun Woo Lee

IPC分类号： B32B41/00 ,  G06T7/62 ,  B05D5/10 ,  C09J5/00 ,  G01B11/06 ,  G06T7/00

CPC分类号： G06T7/62 ,  B05D5/10 ,  C09J5/00 ,  G01B11/0608 ,  G06T7/0004 ,  G06T2207/30108

摘要： An apparatus and method for applying a multi-component curable composition is disclosed. The method for applying a multi-component curable composition includes a) applying a plurality of fluids constituting the multi-component curable composition to a surface of a bonding target object layer by layer, b) acquiring a two-dimensional image of all the fluids applied layer by layer using an image sensor, c) measuring a height of all the fluids applied layer by layer using a distance sensor, and d) calculating a total volume of the multi-component curable composition by using the two-dimensional image and height of the fluids obtained in b) and c).