公开(公告)号：US20200097694A1

公开(公告)日：2020-03-26

申请号：US16621302

申请日：2018-06-11

Applicant: FINGERPRINT CARDS AB

Inventor： Karl LUNDAHL

IPC: G06K9/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  G06K19/077

Abstract: There is provided a fingerprint sensor module comprising a fingerprint sensor device comprising a sensing array and at least one connection pad for electrically connecting the fingerprint sensor device to external circuitry, the sensing array and connection pad being located on a first side of the fingerprint sensing device; at least one electrically conductive via connection arranged adjacent to the fingerprint sensor device and in electrical contact with the connection pad via at least one conductive trace located in the same plane as the connection pad; a mold layer arranged to cover a backside of the fingerprint sensor device and to fill a volume between the fingerprint sensor device and the via connection, wherein an end portion of the via connection is exposed for connecting the fingerprint sensor module to external circuitry. There is also provided a method for manufacturing such a fingerprint sensor module.

公开(公告)号：US20210209324A1

公开(公告)日：2021-07-08

申请号：US17058943

申请日：2019-05-27

Applicant: Fingerprint Cards AB

Inventor： Karl LUNDAHL ,  Hanna NILSSON ,  Adam BENSON ,  Martin GRIP

IPC: G06K9/00 ,  A61B5/1172 ,  G01S15/89

Abstract: An acoustic biometric imaging system comprising: a transparent device member having a first face to be touched by a finger surface of a user, and a second face opposite the first face, the transparent device member having a first acoustic impedance; a first ultrasonic transducer acoustically coupled to the second face of the transparent device member in a first transducer region for receiving acoustic signals conducted by the transparent device member from a finger touch region laterally spaced apart from the first transducer region, the first ultrasonic transducer having a second acoustic impedance; and an opaque masking layer arranged between the transparent device member and the first ultrasonic transducer in the first transducer region, the opaque masking layer having a third acoustic impedance between the first acoustic impedance and the second acoustic impedance.

公开(公告)号：US20200279088A1

公开(公告)日：2020-09-03

申请号：US16645908

申请日：2018-09-17

Applicant: FINGERPRINT CARDS AB

Inventor： Karl LUNDAHL

IPC: G06K9/00 ,  B06B1/06 ,  H01L41/113

Abstract: An ultrasonic transducer device for use in an acoustic biometric imaging system, the ultrasonic transducer device comprising: a first piezoelectric element having a first face, a second face opposite the first face, and side edges extending between the first face and the second face; a first transducer electrode on the first face of the first piezoelectric element; a second transducer electrode on the second face of the first piezoelectric element; and a spacer structure leaving at least a portion of the first transducer electrode of the first piezoelectric element uncovered.

公开(公告)号：US20200279089A1

公开(公告)日：2020-09-03

申请号：US16645959

申请日：2018-09-17

Applicant: FINGERPRINT CARDS AB

Inventor： Karl LUNDAHL ,  Hanna NILSSON ,  Martin GRIP

IPC: G06K9/00 ,  H01L41/047 ,  H01L41/311 ,  B06B1/06

Abstract: A method of manufacturing ultrasonic transducer devices, comprising fabricating an ultrasonic transducer panel; and dividing the ultrasonic transducer panel into ultrasonic transducer devices. Fabricating the ultrasonic transducer panel includes: providing a first carrier; arranging a plurality of piezoelectric elements spaced apart on the first carrier; applying a dielectric material on the plurality of piezoelectric elements to embed each piezoelectric element in the plurality of piezoelectric elements in the dielectric material, thereby forming a piezoelectric element device layer on the first carrier; thinning the piezoelectric element device layer, resulting in an exposed first side of each piezoelectric element in the plurality of piezoelectric elements; forming a first electrode layer on the piezoelectric element device layer, the first electrode layer including a first transducer electrode on the exposed first side of each piezoelectric element in the piezoelectric element device layer; and separating the piezoelectric element device layer from the first carrier.

公开(公告)号：US20200210667A1

公开(公告)日：2020-07-02

申请号：US16623443

申请日：2018-08-21

Applicant: Fingerprint Cards AB

Inventor： Hanna NILSSON ,  Adam BENSON ,  Karl LUNDAHL

IPC: G06K9/00 ,  H01L27/01

Abstract: A method for manufacturing a fingerprint sensor device. The method comprises providing a fingerprint sensor chip, arranging the fingerprint sensor chip on a carrier, depositing a cover layer on the fingerprint sensor chip, the cover layer comprising a polarizable material; moving a top electrode into contact with a top surface of the cover layer; and applying a voltage between the top electrode and a bottom electrode located below the cover layer and comprised in a material stack between the bottom of the carrier and the cover layer, creating an electric field in the cover layer, thereby poling the cover layer such that a dielectric constant of the cover layer in a direction perpendicular to the sensing array is higher than a dielectric constant in a direction parallel to the sensing array, thereby forming a cover layer having an anisotropic dielectric constant.

公开(公告)号：US20170316247A1

公开(公告)日：2017-11-02

申请号：US15654798

申请日：2017-07-20

Applicant: Fingerprint Cards AB

Inventor： Karl LUNDAHL ,  Hanna NILSSON

IPC: G06K9/00

CPC classification number: G06K9/0002 ,  G06K9/00 ,  G06K9/00053 ,  G06K9/00087

Abstract: The invention relates to a fingerprint sensing device comprising a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements and comprising a plurality of cavities filled with a dielectric material. The dielectric material comprises reduced graphene oxide. Locations of the cavities correspond to locations of the sensing elements such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element. A dielectric constant of the dielectric material is higher than a dielectric constant of the coating material. The invention also relates to a sensing device where the dielectric coating layer containing reduced graphene oxide comprises trenches corresponding to areas between the sensing pixels filled with a fill material, where the dielectric coating layer has a higher dielectric constant than the fill material.

公开(公告)号：US20160354801A1

公开(公告)日：2016-12-08

申请号：US15138525

申请日：2016-04-26

Applicant: Fingerprint Cards AB

Inventor： Karl LUNDAHL

IPC: B05D1/00 ,  B05D1/02 ,  G06K9/00

CPC classification number: G06K9/00053 ,  G06K9/00

Abstract: The invention relates to a fingerprint sensing device comprising a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements, the coating material comprising a plurality of cavities filled with a mold material; wherein locations of the cavities correspond to locations of the sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and wherein a dielectric constant of the mold material is higher than a dielectric constant of the coating material. The invention also relates to a method for manufacturing such a device.

Abstract translation: 本发明涉及一种指纹感测装置，其包括感测芯片，其包括电容感测元件阵列。 感测装置包括布置在感测元件阵列的顶部上的涂层材料，涂层材料包括填充有模具材料的多个空腔; 其中所述腔的位置对应于所述感测元件的位置，使得空腔的横截面面积覆盖相应感测元件的区域的至少一部分; 并且其中所述模具材料的介电常数高于所述涂层材料的介电常数。 本发明还涉及制造这种装置的方法。

公开(公告)号：US20160125220A1

公开(公告)日：2016-05-05

申请号：US14894162

申请日：2014-07-01

Applicant: FINGERPRINT CARDS AB

Inventor： Karl LUNDAHL

IPC: G06K9/00

CPC classification number: G06K9/00053 ,  G06K7/08 ,  G06K9/00006 ,  G06K9/00013 ,  G06K9/0002 ,  G06K9/20 ,  G06K9/209 ,  H01L23/26 ,  H01L23/28 ,  H01L23/3178 ,  H01L23/562 ,  H01L23/564 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A sensing device comprising a plurality of sensing elements, each of the sensing elements being configured to provide a signal indicative of an electromagnetic coupling between the sensing element and a finger placed on a surface of the sensing device, a first layer arranged to cover the plurality of sensing elements, the first layer comprising a plurality of recesses, and a second layer arranged to cover the first layer, the second layer having hydrophobic surface properties. There is also provided a method for manufacturing such a sensing device.

Abstract translation: 一种感测装置，包括多个感测元件，每个感测元件被配置为提供指示感测元件和放置在感测装置的表面上的手指之间的电磁耦合的信号;布置成覆盖多个感测元件的第一层 感测元件，第一层包括多个凹部，以及布置成覆盖第一层的第二层，第二层具有疏水表面性质。 还提供了一种用于制造这种感测装置的方法。

公开(公告)号：US20210224626A1

公开(公告)日：2021-07-22

申请号：US15733899

申请日：2019-05-27

Applicant: Fingerprint Cards AB

Inventor： Karl LUNDAHL ,  Olivier LIGNIER

IPC: G06K19/07 ,  G06K19/077

Abstract: Method for manufacturing a smartcard comprising a fingerprint sensor, the method comprising: arranging a fingerprint sensor module in an opening of a carrier layer of a smartcard body; forming a cavity in the smartcard in an area corresponding to a sensing area of the fingerprint sensor module; forming a plurality of surface structures in the cavity of the smartcard; depositing a liquid hydrophobic material in the cavity to at least partially cover the surface structures and a smartcard manufactured according to the described method.

公开(公告)号：US20200184173A1

公开(公告)日：2020-06-11

申请号：US16623463

申请日：2018-06-21

Applicant: Fingerprint Cards AB

Inventor： Di JIANG ,  Karl LUNDAHL ,  Hadayat KHAN

IPC: G06K9/00 ,  G06K19/07 ,  G06K19/077

Abstract: There is provided a fingerprint sensor module comprising a fingerprint sensor device. The fingerprint sensor device comprises a sensing array consisting of a plurality of sensing elements, the sensor device being configured to acquire an image of a finger placed on a sensing surface of the fingerprint sensor module. The fingerprint sensor module further comprises a substrate comprising an opening, wherein the fingerprint sensor device is arranged in the opening of the substrate and wherein the substrate comprises an antenna embedded in the substrate, the antenna being electrically connected to the fingerprint sensor device.