公开(公告)号：US20130255999A1

公开(公告)日：2013-10-03

申请号：US13847821

申请日：2013-03-20

Applicant: FIRST SOLAR, INC.

Inventor： Benyamin Buller ,  Stephen P. Murphy ,  Raymond Domsic ,  Wenlai Feng

IPC: H05K7/06 ,  H01R43/00 ,  H05K1/02

CPC classification number: H05K7/06 ,  H01L31/02013 ,  H01L31/02021 ,  H01R13/5221 ,  H02S40/34 ,  Y02E10/50 ,  Y10T29/49174

Abstract: Described embodiments provide a conductor interface for a photovoltaic module that includes a raised feature on a bottom surface. Methods of forming such structures are also disclosed, as are photovoltaic modules containing the conductor interface.

Abstract translation: 描述的实施例提供了一种用于光伏模块的导体接口，其包括底表面上的凸起特征。 还公开了形成这种结构的方法，以及包含导体界面的光伏模块也是如此。