SIGNAL TRANSMISSION STRUCTURE FOR SPEAKER
    1.
    发明申请

    公开(公告)号:US20200107093A1

    公开(公告)日:2020-04-02

    申请号:US16234751

    申请日:2018-12-28

    Abstract: A signal transmission structure for speaker includes a base having two outgoing lead grooves provided on the same side thereof; a magnet member arranged on the base; a voice coil movably disposed over the magnet member; two tinsel leads respectively having an end connected to two opposite sides of the voice coil and another end set in the two outgoing lead grooves; and a signal connection board disposed in the base with two tinsel lead welding pads and two hook-up wire welding pads provided on a top and a bottom surface thereof, respectively. The tinsel lead welding pads are located between the voice coil and the outgoing lead grooves, allowing the two tinsel leads to be separately welded thereto. With the above signal transmission structure for speaker, welding of tinsel leads and hook-up wires thereto can be conveniently performed to reduce labor and time costs.

    VIBRATION-DAMPING RECTANGULAR MAGNETIC ASSEMBLY

    公开(公告)号:US20250056153A1

    公开(公告)日:2025-02-13

    申请号:US18784966

    申请日:2024-07-26

    Abstract: A vibration-damping rectangular magnetic assembly includes a rectangular magnetic assembly and a vibration-damping structure. The rectangular magnetic assembly includes a main magnetic plate, magnetic unit, vibration-damping structure connecting portion and vibration-damping groove. The magnetic unit is disposed at the top of the main magnetic plate. The vibration-damping structure connecting portion and the vibration-damping groove are disposed at the bottom of the main magnetic plate, with the vibration-damping groove disposed outside the vibration-damping structure connecting portion. The vibration-damping structure includes a ring-shaped speaker base butting portion, magnetic assembly butting portion disposed inside the ring-shaped speaker base butting portion, first and second resilient connecting modules connected between the ring-shaped speaker base butting portion and the magnetic assembly butting portion. The magnetic assembly butting portion is connected to the vibration-damping structure connecting portion. The first and second resilient connecting modules are disposed at the vibration-damping groove.

    VIBRATION DAMPING LOUDSPEAKER
    3.
    发明申请

    公开(公告)号:US20240430621A1

    公开(公告)日:2024-12-26

    申请号:US18747473

    申请日:2024-06-19

    Abstract: A vibration damping loudspeaker includes a sound-generating unit, a magnetic member, an assembly-auxiliary frame and dampers. Aligning units of the assembly-auxiliary frame are coupled to positioning units of the sound-generating unit. The dampers are symmetrically disposed between the magnetic member and the assembly-auxiliary frame. The sound-generating unit and the magnetic member can be quickly and easily mounted in place because of the assembly-auxiliary frame to not only enhance the production yield of the vibration damping loudspeaker but also allow the dampers to function as a buffer between the sound-generating unit and the magnetic member, so as to achieve vibration damping and vibration isolation during the operation of the vibration damping loudspeaker to spare users the discomfort they will otherwise experience for using electronic devices.

    THIN SPEAKER STRUCTURE
    4.
    发明申请
    THIN SPEAKER STRUCTURE 有权
    细微扬声器结构

    公开(公告)号:US20150016658A1

    公开(公告)日:2015-01-15

    申请号:US14019904

    申请日:2013-09-06

    Inventor: PING-YU LEE

    CPC classification number: H04R9/045

    Abstract: A thin speaker structure comprises: a long support frame; a magnetic circuit member; a voice coil; a membrane; wherein the magnetic circuit member and voice coil are rounded and the membrane includes an elliptic surrounding and an elliptic body with a center portion and a peripheral portion; the peripheral portion is fixed to a bottom edge of an inner surface of the surrounding and the center portion corresponding to the peripheral portion defines a rigid strengthened region in a longer elliptic shape; the center portion has a length of a long side longer than a diameter of the voice coil at a predetermined distance; whereby the elliptic body is combined with the circular voice coil to form a vibrating structure in order to increase the rigidity of the membrane.

    Abstract translation: 薄型扬声器结构包括:长支架; 磁路部件; 音圈 膜; 其中所述磁路部件和所述音圈是圆形的,并且所述膜包括椭圆环绕体和具有中心部分和周边部分的椭圆体; 周边部分固定在周围的内表面的底部边缘,并且与周边部分对应的中心部分限定了较长椭圆形的刚性强化区域; 中心部分具有比预定距离的音圈直径长的长边长度; 由此椭圆体与圆形音圈组合以形成振动结构,以增加膜的刚性。

    DOUBLE-SIDED LOUDSPEAKER
    5.
    发明公开

    公开(公告)号:US20240089666A1

    公开(公告)日:2024-03-14

    申请号:US18079902

    申请日:2022-12-13

    CPC classification number: H04R9/063 H04R7/04 H04R9/025 H04R9/046

    Abstract: A double-sided loudspeaker includes a first speaker base and a second speaker base assembled with each other and provided with a ventilation hole; a first side magnetic plate injection molded at the first speaker base or the second speaker base; a second side magnetic plate injection molded at the first speaker base or the second speaker base; a magnetic member disposed between the first side magnetic plate and the second side magnetic plate and including a main magnetic plate, a first magnetic unit and a second magnetic unit; a first diaphragm disposed at the first speaker base; a first voice coil disposed at the first diaphragm and movably arranged at the first magnetic unit; a second diaphragm disposed at the second speaker base; and a second voice coil disposed at the second diaphragm and movably arranged at the second magnetic unit.

    SUPPORT FRAME FOR THIN MINI SPEAKER STRUCTURE AND METHOD OF ASSEMBLING LEAD WIRES TO SUPPORT FRAME OF THIN MINI SPEAKER STRUCTURE

    公开(公告)号:US20170164082A1

    公开(公告)日:2017-06-08

    申请号:US15013949

    申请日:2016-02-02

    Inventor: PING-YU LEE

    Abstract: A support frame for a thin mini speaker structure thinner than 10 mm includes a main body having a fixing hole, into which a magnet assembly is mounted to locate below a voice coil; two electrically conductive members disposed on the main body; two lead wire holders disposed on the main body between the fixing hole and the electrically conductive members and each defining a lead wire receiving groove thereon; a first damping colloid applied into the lead wire receiving grooves. Two lead wires of the voice coil are set in the first damping colloid in the lead wire receiving grooves and the electrically conductive members to respectively present an outward curved shape. A thin mini speaker lead wire assembling method is also introduced. With the above support frame and method, two ends of the voice coil windings can be directly used as lead wires to save additional tinsel leads.

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