公开(公告)号：US20220260875A1

公开(公告)日：2022-08-18

申请号：US17629407

申请日：2020-06-29

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

Inventor： Changqi WANG ,  Kuai QIN ,  Heng GUO ,  Qiang ZHAO ,  Kailiang FAN

IPC: G02F1/13357 ,  H01L25/075 ,  H01L33/62 ,  H01L33/38

Abstract: Some embodiments of the present disclosure relate to the technical field of Light-Emitting Diodes (LEDs), for example, an LED line backlight source liquid crystal display screen, including liquid crystal glass and a light guide plate. The light guide plate is provided on one side of the liquid crystal glass, the outside of the end surface of a first end of the light guide plate and the outside of the end surface of a second end thereof are both provided with LED line backlight sources, the LED line backlight source includes an elongated circuit substrate, a side of the circuit substrate close to the light guide plate is provided with at least one row of light-emitting assemblies, and each row of the light-emitting assemblies includes a plurality of red, green, and blue (RGB) light-emitting units arranged at intervals along the length direction of the circuit substrate.

公开(公告)号：US20200378595A1

公开(公告)日：2020-12-03

申请号：US16883163

申请日：2020-05-26

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Qiang ZHAO ,  Kuai QIN ,  Heng GUO ,  Changqi WANG ,  Zongxian XIE ,  Kailiang FAN

IPC: F21V33/00 ,  F21V19/00

Abstract: A blade assembly and a fan display including the same. The blade assembly includes a circuit substrate provided in an elongated shape, a lamination board provided in an elongated shape and bonded to the circuit substrate by a laminating glue, and a plurality of light emitting diode (LED) light emitting units. A mounting hole is defined in the lamination board and passes through a thickness of the lamination board. The circuit substrate has a first side attached to the lamination board, the first side and the mounting hole jointly defining a mounting cavity, in which plurality of LED light emitting units are hermetically disposed in the mounting cavity, and are arranged at intervals along a length of the circuit substrate.