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公开(公告)号：US12087213B2
公开(公告)日：2024-09-10
申请号：US18457755
申请日：2023-08-29
发明人： Libing Pan , Zhiguo Xie , Penghui Dong , Xiaoji Zhang , Danlei Gong , Man Zhao , Zihao Chen
IPC分类号： G09G3/32 , F21K9/235 , F21K9/237 , F21K9/238 , F21W131/30
CPC分类号： G09G3/32 , F21K9/235 , F21K9/237 , F21K9/238 , F21W2131/30 , G09G2320/02
摘要： Provided are a beveled light-emitting lamp bead, a beveled light-emitting lamp bead holder, a manufacturing method therefor, and a display device. The beveled light-emitting lamp bead holder includes a holder body and a metal holder embedded in the holder body, where the holder body is divided by the metal holder into a cup shield located on a top side and a support structure located on a bottom side, a cup bottom in the cup shield is provided with a chip mounting surface parallel to a cup rim top surface, a bottom portion of the support structure is provided with a soldering plane, the soldering plane is electrically connected to the chip mounting surface through the metal holder, and an inclination angle is formed between the chip mounting surface and the soldering plane.
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2.发明公开公开(公告)号：US20240144864A1
公开(公告)日：2024-05-02
申请号：US18457755
申请日：2023-08-29
发明人： Libing PAN , Zhiguo XIE , Penghui DONG , Xiaoji ZHANG , Danlei GONG , Man ZHAO , Zihao CHEN
CPC分类号： G09G3/32 , F21K9/235 , F21K9/237 , F21K9/238 , F21W2131/30 , G09G2320/02
摘要： Provided are a beveled light-emitting lamp bead, a beveled light-emitting lamp bead holder, a manufacturing method therefor, and a display device. The beveled light-emitting lamp bead holder includes a holder body and a metal holder embedded in the holder body, where the holder body is divided by the metal holder into a cup shield located on a top side and a support structure located on a bottom side, a cup bottom in the cup shield is provided with a chip mounting surface parallel to a cup rim top surface, a bottom portion of the support structure is provided with a soldering plane, the soldering plane is electrically connected to the chip mounting surface through the metal holder, and an inclination angle is formed between the chip mounting surface and the soldering plane.
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公开(公告)号：US11927848B2
公开(公告)日：2024-03-12
申请号：US17940512
申请日：2022-09-08
发明人： Weineng Chen , Danlei Gong , Hua Fan , Zhonghai Yan , Zihao Chen , Xiang Chen , Yushan Lin , Ke Yang , Fabo Liu
IPC分类号： G02F1/13357
CPC分类号： G02F1/133603 , G02F1/133605
摘要： Provided are a light source module and a backlight display module. The light source module includes a flexible printed circuit board and a plurality of side-emitting LEDs. The flexible printed circuit board extends along a central axis. The plurality of side-emitting LEDs are sequentially arranged along the central axis and bonded to the flexible printed circuit board, and a light-emitting surface of one side-emitting LED of the plurality of side-emitting LEDs is perpendicular to a bonding surface of the flexible printed circuit board.
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公开(公告)号：US11757069B2
公开(公告)日：2023-09-12
申请号：US16609453
申请日：2018-10-23
发明人： Haijun Wang , Yangcheng Huang , Xiang Chen , Fabo Liu , Zhonghai Yan , Danlei Gong , Junhua Chen , Yushan Lin , Jian Gan , Haixing Tan
CPC分类号： H01L33/504 , C09K11/0883 , C09K11/77348 , C09K11/77927 , H01L2933/0041
摘要： The disclosure provides an LED white light device, including a blue light chip and phosphors. The blue light chip has a band of (455-470) nm. The phosphors include a dual-band yellow phosphor and a red phosphor having an excited light peak wavelength range of (610-660) nm. The yellow phosphor and the red phosphor are mixed according to a proportion of 1:(0.03-0.2) and cover the blue light chip, such that blue light emitted by the packaged LED white light device has a peak wavelength range of (450-465) nm. The disclosure also provides a preparation method of an LED white light device and an LED backlight module adopting the above LED white light device. The disclosure achieves the effects of blue light prevention, high color gamut and pure white simultaneously, Color uniformity and consistency are good, and a blue-green-red three-color continuous spectrum is provided, which is closer to a solar spectrum.
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5.发明公开公开(公告)号：US20230217586A1
公开(公告)日：2023-07-06
申请号：US18091539
申请日：2022-12-30
发明人： Xinghan HE , Danlei GONG , Zhonghai YAN , Hua FAN , Fabo LIU , Youwei ZHAN , Weineng CHEN , Taotao SONG
CPC分类号： H05K1/0271 , F21V19/0025 , F21V29/70 , H05K1/0203 , H05K3/306 , H05K3/4038 , F21Y2105/10
摘要： Provided are a light board, a method for manufacturing the same, a light-emitting diode (LED) backlight module and an LED backlight device. The light board includes a substrate and a LED device. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface and the second surface are each provided with a wiring area and a non-wiring area. A first heat sink assembly and multiple first reinforcement ribs are disposed in the non-wiring area of the first surface. The multiple first reinforcement ribs intersect to form a first encircled area. The first heat sink assembly is disposed in the first encircled area. The LED device is disposed in the wiring area of the second surface.
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公开(公告)号：US20230217580A1
公开(公告)日：2023-07-06
申请号：US17867774
申请日：2022-07-19
发明人： Nianbin Cheng , Cheng Li , Lifang Liang , Yikai Yuan , Honggui Zhan , Xiangxuan Tan
摘要： Provided are a power module and a heat sink system. The power module includes a first circuit board, a second circuit board, at least one discrete component and an encapsulation body. One discrete component includes a lead frame and at least one chip, the lead frame is disposed between the first circuit board and the second circuit board, the lead frame includes two end faces and multiple mounting lateral surfaces connected in sequence, an angle is formed between one end face and one mounting lateral surface, one of the two end faces is electrically connected to the first circuit board and the other of the two end faces is electrically connected to the second circuit board, and the chip is disposed on each of the multiple mounting lateral surfaces. The encapsulation body is configured to pot a space between the first circuit board and the second circuit board.
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公开(公告)号：US20230155092A1
公开(公告)日：2023-05-18
申请号：US17910295
申请日：2021-03-25
发明人： Kuai Qin , Shaojia Xie , Feng Gu , Bin Cai , Kailiang Fan , Zhuang Peng
IPC分类号： H01L33/62 , H01L27/15 , H01L25/075 , H01L33/38
CPC分类号： H01L33/62 , H01L27/156 , H01L25/0753 , H01L33/38
摘要： Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units. The circuit board includes N metal wiring layers stacked in sequence and an insulating plate disposed between adjacent metal wiring layers, and the N metal wiring layers are electrically connected through conductive vias on the insulating plate. The pixel units are arranged in an array of m rows and n columns and disposed on the circuit board. Each pixel unit includes at least two LED light-emitting chips with different emitted colors, each LED light-emitting chip is fixed on a first metal wiring layer. The first metal wiring layer includes m common A-electrode pads, A-electrode pads, and B-electrode pads. All the A-electrode pads corresponding to each row of pixel units are integrally formed with and electrically connected to one corresponding common A-electrode pad.
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公开(公告)号：US20230095880A1
公开(公告)日：2023-03-30
申请号：US17940512
申请日：2022-09-08
发明人： Weineng Chen , Danlei Gong , Hua Fan , Zhonghai Yan , Zihao Chen , Xiang Chen , Yushan Lin , Ke Yang , Fabo Liu
IPC分类号： G02F1/13357
摘要： Provided are a light source module and a backlight display module. The light source module includes a flexible printed circuit board and a plurality of side-emitting LEDs. The flexible printed circuit board extends along a central axis. The plurality of side-emitting LEDs are sequentially arranged along the central axis and bonded to the flexible printed circuit board, and a light-emitting surface of one side-emitting LED of the plurality of side-emitting LEDs is perpendicular to a bonding surface of the flexible printed circuit board.
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公开(公告)号：US11016340B2
公开(公告)日：2021-05-25
申请号：US16908772
申请日：2020-06-23
发明人： Junhua Chen , Fabo Liu , Danlei Gong , Zhonghai Yan , Xiang Chen , Yao Weng
IPC分类号： G02F1/13357 , H01L33/56 , H01L33/60
摘要： The disclosure provides a LED device, a backlight module and a display device. The LED device includes: a bracket structure and a chip, the bracket structure having a cup cavity and the chip being mounted in the cup cavity; a packaging structure, the packaging structure being provided on the bracket structure in a covering manner to seal the cup cavity and an upper surface, far away from the cup cavity, of the packaging structure forming an emergent surface; and a reflective shielding layer, the reflective shielding layer being provided on the packaging structure and the reflective shielding layer being at a central position of the emergent surface and covering part of the emergent surface. According to the disclosure, the problem in the related art that it is impossible to consider both a good color saturation and brightness contrast of a display of a display device is solved.
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10.发明申请公开(公告)号：US20210013386A1
公开(公告)日：2021-01-14
申请号：US16766716
申请日：2018-08-28
发明人： Ziheng ZENG , Zhiguo XIE , Fuhai LI , Libing PAN
IPC分类号： H01L33/62 , H01L33/48 , H01L33/54 , H01L25/075
摘要： Some embodiments of the disclosure provide an LED device, an LED lamp and a method for machining a conductive wire of an LED device. The Light-Emitting Diode (LED) device includes at least one LED chip, a bracket and at least one conductive wire. Each of the at least one conductive wire is of a three-dimensional structure and includes a vertical section, first stress cushioning section inclined obliquely upwards, second stress cushioning section inclined obliquely downwards and third stress cushioning section inclined obliquely downwards that are sequentially arranged. A first transition bending section, a second transition bending section and a third transition bending section are sequentially formed between the vertical section, the first stress cushioning section, the second stress cushioning section and the third stress cushioning section, the first transition bending section, the second transition bending section and the third transition bending section are sequentially arranged along a length direction of the conductive wire, and bending directions of the second transition bending section and the third transition bending section are opposite. One end of the conductive wire is configured to connect the LED chip, and the other end is configured to connect the bracket or another LED chip. The present invention also discloses an LED lamp and a method for machining a conductive wire of an LED device. The reliability of the LED device of the present invention is improved to a certain extent.
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