公开(公告)号：US20190355294A1

公开(公告)日：2019-11-21

申请号：US15995248

申请日：2018-06-01

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Feng GU ,  Chuanbiao LIU ,  Kuai QIN ,  Xi ZHENG ,  Yuanbin LIN

IPC: G09G3/32 ,  G09G3/34

Abstract: The disclosure provides an LED display unit group and display panel, including a pixel unit array of n rows and m columns of pixel units. n and m are positive integers not less than 2. Each pixel unit includes a first, a second and a third LED chip. In the i-th row, the A-electrodes of all the LED chips in m pixel units are connected together, and are electrically connected to the i-th common A-electrode pin. In the j-th column, the B-electrodes of n first LED chips are connected together and are electrically connected to the j-th first B-electrode pin, the B-electrodes of n second LED chips are connected together and electrically connected to the j-th second B-electrode pin, and the B-electrodes of n third LED chips are connected together and are electrically connected to j-th third B-electrode pin of the LED display unit group.

公开(公告)号：US20190244939A1

公开(公告)日：2019-08-08

申请号：US16340150

申请日：2017-10-17

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD

Inventor： Chuanbiao LIU ,  Xiaofeng LIU ,  Feng GU ,  Kuai QIN

IPC: H01L25/075

Abstract: A Chip-on-Board (COB) display module is provided, which includes a Printed Circuit Board (PCB) a plurality of Light-Emitting Diode (LED) luminous units, a packaging adhesive layer and a light shielding layer wherein the plurality of LED luminous units are mounted and fixed on the PCB, the packaging adhesive layer covers the PCB and wraps the LED luminous units thereon, a liquid passage is provided in the packaging adhesive layer between every two adjacent LED luminous units, and the light shielding layer fills the liquid passage. The COB display module further includes a reflecting layer, and the reflecting layer covers two sidewalls of the liquid passage, and is positioned between the packaging adhesive layer and the light shielding layer. A manufacturing method for the COB display module is also disclosed.

公开(公告)号：US20200083420A1

公开(公告)日：2020-03-12

申请号：US16502101

申请日：2019-07-03

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Feng GU ,  Kuai QIN ,  Yuanbin LIN ,  Bin CAI

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/538

Abstract: Provided is a light-emitting diode (LED) display unit group and a display panel. The LED display unit group includes a circuit board, and a pixel unit array located on the circuit board. The pixel unit array includes a plurality of pixel units arranged in n rows and m columns, n and m are both positive integers and greater than or equal to 2. Each of the pixel units includes multiple LED light-emitting chips of at least two colors, each of the LED light-emitting chips includes an electrode A and an electrode B of opposite polarities. The LED light-emitting chip of each of the pixel units includes at least one dual-electrode chip, the dual-electrode chip has the electrode A and the electrode B located on a same side of the dual-electrode chip. All dual-electrode chips in the plurality of pixel units of a same color have connecting lines from the electrode A to the electrode B directed in a same direction.