公开(公告)号：US20220112604A1

公开(公告)日：2022-04-14

申请号：US17476508

申请日：2021-09-16

Applicant: FOUNDATION OF SOONGSIL UNIVERSITY-INDUSTRY COOPERATION

Inventor： Kuan Soo SHIN ,  Jeong Hei CHOI ,  Yoon Kyung JUNG ,  Min Young CHO

IPC: C23C18/44 ,  C23C18/16

Abstract: The present invention relates to a composition for electroless platinum plating and an electroless platinum plating method using the same, wherein it is possible to easily and safely produce a uniformly dispersed platinum thin film without expensive additional equipment by performing electroless platinum plating with a composition for electroless platinum plating containing an alcohol, an aqueous solution of a platinum chloride compound, and an aqueous solution of a basic compound.