公开(公告)号：US20150171577A1

公开(公告)日：2015-06-18

申请号：US14569773

申请日：2014-12-14

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： HAO HAN ,  BING WANG ,  BO HUANG

IPC: H01R24/64 ,  H01R13/405

CPC classification number: H01R24/64 ,  H01R13/6675 ,  H01R2201/04

Abstract: A modular jack includes an insulative housing, an oblique inner PCB mounted on the insulative housing, a number of mating contacts soldered to the top edge portion of the inner PCB, a number of footer pins soldered to the bottom edge portion of the inner PCB, and a number of POE leads soldered to the top edge portion. The contacts, footer pins, and POE leads are retained on the same piece insulative housing, thus omitting requirement of an insulative carrier and a process of assembling the footer pins and POE leads to the insulative carrier. Each of the contacts, footer pins, and POE leads has a connecting section extending along a same direction in order for the tail sections to be soldered on a same top face of the inner PCB by a one-time soldering process.

Abstract translation: 模块化插座包括绝缘壳体，安装在绝缘壳体上的倾斜内部PCB，焊接到内部PCB的顶部边缘部分的多个配合触点，焊接到内部PCB的底部边缘部分的多个脚踏销， 以及焊接到顶部边缘部分的多个POE引线。 接触件，脚脚销和POE引线保持在同一件绝缘外壳上，因此省略了绝缘载体的要求以及将脚脚和POE引线组装到绝缘载体上的过程。 触点，脚脚和POE引线中的每一个具有沿相同方向延伸的连接部分，以便通过一次焊接工艺将尾部部分焊接在内部PCB的同一顶面上。