SYSTEM FOR WAFER-LEVEL TESTING OF MEMS PRESSURE SENSORS
    1.
    发明申请
    SYSTEM FOR WAFER-LEVEL TESTING OF MEMS PRESSURE SENSORS 审中-公开
    MEMS压力传感器的水平测试系统

    公开(公告)号:US20160116361A1

    公开(公告)日:2016-04-28

    申请号:US14525408

    申请日:2014-10-28

    CPC classification number: B81C99/005 G01L27/005

    Abstract: A system for testing pressure sensors on a device wafer includes a tray for holding the device wafer. The tray includes a base having a surface, a spacer extending from the surface, and a tacky material disposed on the surface. The spacer holds the device wafer spaced apart from the surface of the base to form a chamber between the surface and the device wafer. A wafer chuck retains the tray and the device wafer under vacuum. The system further includes a nozzle and a seal element in fixed engagement with the nozzle. The seal element surrounds the outlet of the nozzle and is adapted for mechanical contact with the device wafer. An actuator is configured to place the nozzle and a diaphragm of one of the pressure sensors in proximity to one another, wherein a pneumatic pressure stimulus is applied to the diaphragm via an outlet of the nozzle.

    Abstract translation: 用于测试器件晶片上的压力传感器的系统包括用于保持器件晶片的托盘。 托盘包括具有表面的基部,从表面延伸的间隔件和布置在表面上的粘性材料。 间隔件将装置晶片保持与基座的表面间隔开,以在表面和器件晶片之间形成一个腔室。 晶片卡盘将托盘和器件晶片保持在真空下。 该系统还包括与喷嘴固定接合的喷嘴和密封元件。 密封元件围绕喷嘴的出口并且适于与装置晶片机械接触。 致动器构造成将喷嘴和其中一个压力传感器的隔膜彼此靠近放置,其中气动压力刺激经由喷嘴的出口施加到隔膜。

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