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公开(公告)号：USD1037163S1
公开(公告)日：2024-07-30
申请号：US29818441
申请日：2021-12-08
设计人： Tsubasa Nakamura , Daiki Yoshida , Takahiro Koyama
摘要： FIG. 1 is a front view of a semiconductor module showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is another perspective view thereof.
The broken lines illustrate portions of the article that form no part of the claimed design.
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