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公开(公告)号：US11664296B2
公开(公告)日：2023-05-30
申请号：US17183389
申请日：2021-02-24
IPC分类号： H01L23/473 , H01L23/40
CPC分类号： H01L23/473 , H01L23/4006 , H01L2023/4043 , H01L2023/4087
摘要： Provided is a semiconductor module including semiconductor devices and a cooling apparatus, wherein the semiconductor device has semiconductor chips and a circuit board with the semiconductor chips implemented thereon; the cooling apparatus has a top plate, a side wall, a bottom plate, a coolant flow portion, an inlet, an outlet and a plurality of fins; the top plate and the bottom plate have three through holes that are through holes for inserting fastening members that fasten the semiconductor module to an external apparatus, penetrating the top plate and the bottom plate in one direction respectively; and a geometric center of gravity of a aperture of at least one of the inlet and the outlet may also be positioned inside a virtual triangle with the three through holes being vertexes in planar view.
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公开(公告)号：US12127382B2
公开(公告)日：2024-10-22
申请号：US17679867
申请日：2022-02-24
IPC分类号： H05K7/20 , H01L23/367 , H01L23/473 , H01L25/07 , H01L25/18
CPC分类号： H05K7/20927 , H01L23/3677 , H01L23/473 , H05K7/20254 , H01L25/072 , H01L25/18
摘要： A semiconductor module includes a cooling device that includes: a ceiling plate; a side wall; a bottom plate; a plurality of pin fins having a polygonal shape and arranged in a matrix form in which one end of the respective pin fins is connected to a fin region having a rectangular shape; an inlet for a coolant at a first position adjacent to a part of one of long sides of the fin region, and an outlet for the coolant at a second position adjacent to a part of the other long side of the fin region. The matrix directions of the respective pin fins make an angle with a straight line connecting the first position and the second position, and a length of a segment of the straight line passing across the fin region is longer than a length of short sides of the fin region.
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公开(公告)号：USD774479S1
公开(公告)日：2016-12-20
申请号：US29528214
申请日：2015-05-27
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公开(公告)号：US12074091B2
公开(公告)日：2024-08-27
申请号：US17538829
申请日：2021-11-30
发明人： Takahiro Koyama , Hiromichi Gohara
IPC分类号： H01L23/473 , H01L25/07
CPC分类号： H01L23/473 , H01L25/072
摘要： A semiconductor device includes an insulating substrate, semiconductor elements mounted on the insulating substrate, and a cooler for cooling the semiconductor elements. The cooler includes a heat dissipating substrate having bonding and heat dissipating surfaces opposite to each other, the bonding surface being bonded to the second surface of the insulating substrate, a plurality of fins on the heat dissipating surface, a reinforcing plate having first and second surfaces opposite to each other and covering the fins, the first surface being bonded to tips of the fins, and a cooling case including a recessed part to house the fins and reinforcing plate. A first gap between two adjacent fins, measured in a direction parallel to the heat dissipating substrate, is larger than a second gap between the reinforcing plate and a bottom of the first recessed part, measured in a thickness direction.
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公开(公告)号：US11362017B2
公开(公告)日：2022-06-14
申请号：US16368756
申请日：2019-03-28
发明人： Takahiro Koyama
IPC分类号： H01L23/473 , F28F9/02 , F28F3/02 , H05K7/20
摘要： The flow speed distribution of a refrigerant in a cooling apparatus is made uniform. A cooling apparatus provided includes: a top plate; a casing portion having a base plate facing the top plate, and a refrigerant delivery portion arranged between the top plate and the base plate, the casing portion provided with two opening portions to function as an inlet port through which a refrigerant is let into the refrigerant delivery portion and an outlet port through which the refrigerant is let out; a cooling fin portion arranged in the refrigerant delivery portion of the casing portion and between the two opening portions; and a loss adding portion arranged in the refrigerant delivery portion of the casing portion and between the cooling fin portion and at least one of the two opening portions, the loss adding portion generating pressure loss in the refrigerant passing therethrough.
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公开(公告)号：US10192807B2
公开(公告)日：2019-01-29
申请号：US15606787
申请日：2017-05-26
发明人： Takahiro Koyama , Hiromichi Gohara
IPC分类号： H01L23/34 , H01L23/473 , H01L25/07 , H01L25/18 , H01L23/367 , H01L23/40 , H01L23/373
摘要： The invention is provided with a metal base plate including a first surface and a second surface and a cooling case including a bottom wall and a side wall formed around the bottom wall, in which one end of the side wall being joined to a second surface side of the metal base plate, and a coolant can be circulated in a space enclosed by the metal base plate, the bottom wall, and the side wall, in which the cooling case has an inlet portion and an outlet portion for the coolant which are connected to either the bottom wall or the side wall and disposed along a peripheral edge of the second surface of the metal base plate, and includes a first flange disposed at an inlet opening side of the inlet portion and a second flange disposed at an outlet opening side of the outlet portion.
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公开(公告)号：US11996350B2
公开(公告)日：2024-05-28
申请号：US17389911
申请日：2021-07-30
IPC分类号： H01L23/473 , H01L25/07 , H05K7/20
CPC分类号： H01L23/473 , H01L25/072 , H05K7/20927
摘要： A cooler includes a top plate having a plurality of fins provided on a surface thereof, and a circumferential wall part provided so as to surround outer circumferences of the plurality of fins along outer circumferential edges of the top plate, and a bottom plate bonded to distal ends of the circumferential wall part and the plurality of fins. A flow path for a coolant is formed by a space enclosed by the top plate, the circumferential wall part and the bottom plate. The bottom plate has inlet and discharge portions for the coolant. The inlet and discharge portions are disposed so as to face each other diagonally with the plurality fins interposed therebetween. An inner surface of the circumferential wall part has a step part that tilts from the inner surface of the circumferential wall part toward the discharge portion at a position neighboring to the discharge portion.
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公开(公告)号：USD827593S1
公开(公告)日：2018-09-04
申请号：US29632135
申请日：2018-01-05
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公开(公告)号：US09991188B2
公开(公告)日：2018-06-05
申请号：US15287870
申请日：2016-10-07
发明人： Takahiro Koyama
IPC分类号： H01L23/473 , H01L23/367 , F28D15/02 , H01L23/427
CPC分类号： H01L23/473 , F28D15/0266 , H01L23/3675 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooler with a cooler main body that, in one configuration, includes a first wall portion forming a cooling surface that cools an electronic component, a second wall portion disposed opposing the first wall portion, and a side wall portion that connects a periphery of the first wall portion and a periphery of the second wall portion. In the configuration, cooling fins are attached to an inner wall surface of the first wall portion, a refrigerant introduction pipe and refrigerant introduction flow path for supplying refrigerant to the cooling fins and a refrigerant discharge pipe and refrigerant discharge flow path for ejecting refrigerant from the cooling fins are included, and protruding portions and are provided on the first wall portion side of the refrigerant introduction flow path.
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公开(公告)号：USD1037163S1
公开(公告)日：2024-07-30
申请号：US29818441
申请日：2021-12-08
设计人： Tsubasa Nakamura , Daiki Yoshida , Takahiro Koyama
摘要： FIG. 1 is a front view of a semiconductor module showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is another perspective view thereof.
The broken lines illustrate portions of the article that form no part of the claimed design.
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