COMPONENT SUPPLY DEVICE AND MOUNTING MACHINE

    公开(公告)号:US20180249606A1

    公开(公告)日:2018-08-30

    申请号:US15552394

    申请日:2015-02-26

    IPC分类号: H05K13/02 H05K13/04 B25J11/00

    摘要: A component supply device including a first posture component main body receiving recessed section corresponding to the shape of a component and a second posture component main body receiving recessed section the same shape as the first posture component main body receiving recessed section, rotated by 180°, and overlapping a portion of the first posture component main body receiving recessed section are formed in a component receiving member. A control device of the component mounting machine side is notified of information indicating the postures of the components which are placed on the component receiving member. Accordingly, the component holding tool of the component mounting machine side is capable of appropriately holding a component from the component receiving member based on the information indicating the postures of the components which are placed on the component receiving member.

    LOOSE COMPONENT SUPPLY DEVICE AND COMPONENT MOUNTER

    公开(公告)号:US20170196131A1

    公开(公告)日:2017-07-06

    申请号:US15314013

    申请日:2014-06-03

    发明人: Kazuma ISHIKAWA

    IPC分类号: H05K13/02 H05K13/08

    摘要: A loose component supply device includes a loose component support section that supports multiple components in a loose state, an imaging device that images the components supported on the loose component support section, a component holding head provided with at least one component holding tool capable of picking up and holding each of the components supported on the loose component support section, a holding head moving device that moves the component holding head at least to and from the loose component support section and a component transfer section at which transfer to a next process is possible, and a holding tool changing device that changes at least one of the one component holding tools based on image data obtained by the imaging of the imaging device.