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1.发明申请公开(公告)号：US20170325371A1
公开(公告)日：2017-11-09
申请号：US15525813
申请日：2014-11-11
发明人： Shigeto OYAMA , Tomokatsu KUBOTA , Jun IISAKA
IPC分类号： H05K13/04
CPC分类号： H05K13/0882 , H05K13/0452 , H05K13/0853
摘要： The control device controls an operation of a mounting head of an electronic component mounting machine. The control device is used when an electronic component is mounted on a printed circuit board including multiple divided boards by using the mounting head having multiple suction nozzles. In the control device, some of the multiple divided boards within the printed circuit board are set as one group based on positions of the multiple suction nozzles and positions of the multiple divided boards within the printed circuit board. In addition, in the control device, the multiple suction nozzles suck the electronic components to be mounted on the divided board within one group at the same time.
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公开(公告)号：US20170223881A1
公开(公告)日：2017-08-03
申请号：US15500708
申请日：2014-08-01
发明人： Tomokatsu KUBOTA , Yasushi KATO
摘要： A component mounting method for using a component mounting tool which includes a plurality of claw sections that pinch and pick up a component at a component supply position, and release the component on a board to mount the component onto a predetermined position of the board, and which is mounted to be capable of moving between the component supply position and the board, includes determining pinching locations of the component to be pinched by the plurality of claw sections such that positions and a release operation of the plurality of claw sections do not interfere with mounted components which are already mounted on the board when the plurality of claw sections release the component.
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