公开(公告)号：US20130237630A1

公开(公告)日：2013-09-12

申请号：US13869591

申请日：2013-04-24

Applicant: FUJIFILM CORPORATION

Inventor： Naoyuki MOROOKA ,  Rie OKUTSU ,  Tatsuhiko OBAYASHI ,  Hiroaki MOCHIZUKI

IPC: C08F222/10

CPC classification number: C08F222/10 ,  G02B1/04 ,  C08L33/10

Abstract: A heat-resistant cured product is efficiently produced by obtaining a semi-cured product where a curable resin composition containing a (meth)acrylate monomer, a non-conjugated vinylidene group-containing compound and a thermal radical-polymerization initiator is processed by at least one of photoirradiation and heating to give a semi-cured product having a complex viscosity of from 105 to 108 mPa·s at 25° C. and at a frequency of 10 Hz; and putting the semi-cured product in a forming die for pressure formation therein, and heating it therein for thermal polymerization to give a cured product.

Abstract translation: 通过获得半固化产物，通过至少加工含有（甲基）丙烯酸酯单体，含非共轭亚乙烯基化合物和热自由基聚合引发剂的固化性树脂组合物，有效地制备耐热固化产物 光照射和加热之一，得到在25℃和10Hz的频率下具有105至108mPa·s的复数粘度的半固化产物; 并将半固化产物放入成形模中进行压力成形，并加热其中进行热聚合，得到固化产物。

公开(公告)号：US20130131212A1

公开(公告)日：2013-05-23

申请号：US13744507

申请日：2013-01-18

Applicant: FUJIFILM Corporation

Inventor： Hiroaki MOCHIZUKI ,  Naoyuki MOROOKA ,  Rie OKUTSU ,  Tatsuhiko OBAYASHI

IPC: C08F265/04

CPC classification number: C08F265/04 ,  C08F220/18 ,  C08F220/28 ,  C08F220/40 ,  C08F265/06

Abstract: Disclosed is a curable resin composition comprising a polymer (A) that has a main chain comprising carbon atoms and a side chain having a polymerizing unsaturated linking group and has a cyclic structure in the main chain and/or the side chain, and a compound having a polymerizing unsaturated group. The curable resin composition has good optical characteristics, good heat resistance and good moldability.

Abstract translation: 本发明公开了一种固化性树脂组合物，其含有具有包含碳原子的主链的聚合物（A）和具有聚合性不饱和连接基且在主链和/或侧链中具有环状结构的侧链，以及具有 聚合不饱和基团。 该固化性树脂组合物具有良好的光学特性，良好的耐热性和良好的成型性。