公开(公告)号：US20130237630A1

公开(公告)日：2013-09-12

申请号：US13869591

申请日：2013-04-24

Applicant: FUJIFILM CORPORATION

Inventor： Naoyuki MOROOKA ,  Rie OKUTSU ,  Tatsuhiko OBAYASHI ,  Hiroaki MOCHIZUKI

IPC: C08F222/10

CPC classification number: C08F222/10 ,  G02B1/04 ,  C08L33/10

Abstract: A heat-resistant cured product is efficiently produced by obtaining a semi-cured product where a curable resin composition containing a (meth)acrylate monomer, a non-conjugated vinylidene group-containing compound and a thermal radical-polymerization initiator is processed by at least one of photoirradiation and heating to give a semi-cured product having a complex viscosity of from 105 to 108 mPa·s at 25° C. and at a frequency of 10 Hz; and putting the semi-cured product in a forming die for pressure formation therein, and heating it therein for thermal polymerization to give a cured product.

Abstract translation: 通过获得半固化产物，通过至少加工含有（甲基）丙烯酸酯单体，含非共轭亚乙烯基化合物和热自由基聚合引发剂的固化性树脂组合物，有效地制备耐热固化产物 光照射和加热之一，得到在25℃和10Hz的频率下具有105至108mPa·s的复数粘度的半固化产物; 并将半固化产物放入成形模中进行压力成形，并加热其中进行热聚合，得到固化产物。

公开(公告)号：US20150197592A1

公开(公告)日：2015-07-16

申请号：US14668474

申请日：2015-03-25

Applicant: FUJIFILM Corporation

Inventor： Ayumi SOMEYA ,  Masataka YOSHIZAWA ,  Tatsuhiko OBAYASHI ,  Hiroyuki NAITOU

IPC: C08F222/20 ,  C08F212/34 ,  G02B1/04 ,  C07C69/602

CPC classification number: C08F222/20 ,  C07C13/66 ,  C07C69/54 ,  C07C69/602 ,  C07C233/20 ,  C07C323/19 ,  C07C323/66 ,  C07C2103/40 ,  C07C2103/52 ,  C07C2603/40 ,  C07C2603/52 ,  C07D209/58 ,  C07D263/52 ,  C07D277/60 ,  C07D307/77 ,  C07D311/96 ,  C07D333/78 ,  C08F12/26 ,  C08F12/32 ,  C08F12/34 ,  C08F212/32 ,  C08F212/34 ,  C08F220/30 ,  C08F222/1006 ,  C09D125/16 ,  G02B1/041 ,  C08L45/00 ,  C08F2222/205

Abstract: A curable resin composition containing a compound of formula (1), a compound of formula (2) and a thermal- or photo-radical polymerization initiator is capable of producing a cured product having a low Abbe's number and capable of realizing burr reduction in molding the composition. Ar1 to Ar4 represent aryl or heteroaryl, at least one of Ar1 to Ar4 is aromatic condensed ring, and two or more of Ar1 to Ar4 have a polymerizable group, and at least one of R21 to R26 forms a ring, or at least two bond to each other to form a ring:

Abstract translation: 含有式（1）化合物，式（2）化合物和热或光自由基聚合引发剂的固化性树脂组合物能够生产具有低阿贝数的固化产物，并且能够实现成型中的毛刺减少 组成。 Ar 1〜Ar 4表示芳基或杂芳基，Ar 1〜Ar 4中的至少一个为芳香族稠合环，Ar 1〜Ar 4中的2个以上具有聚合性基团，R 21〜R 26中的至少一个为环，或至少2个以上 彼此形成一个戒指：

公开(公告)号：US20150018445A1

公开(公告)日：2015-01-15

申请号：US14498384

申请日：2014-09-26

Applicant: FUJIFILM Corporation

Inventor： Yuusuke IIZUKA ,  Tatsuhiko OBAYASHI ,  Naoyuki MOROOKA ,  Takayasu NAGAI ,  Ayumi SOMEYA

IPC: C08F222/14 ,  C08F265/06 ,  G02B1/04 ,  C08F220/68

CPC classification number: C08F222/14 ,  C08F212/08 ,  C08F212/32 ,  C08F212/36 ,  C08F220/30 ,  C08F220/40 ,  C08F220/68 ,  C08F265/04 ,  C08F265/06 ,  C08F290/12 ,  C08F2222/145 ,  G02B1/04 ,  G02B1/041 ,  C08L23/00 ,  C08L33/10 ,  C08L33/08 ,  C08F2220/301

Abstract: A curable resin composition comprising a (meth)acrylate monomer having an aromatic ring, a non-conjugated vinylidene group-containing compound represented by the general formula below, and a thermal or a photo-radical polymerization initiator makes it possible to produce a cured product with minimized occurrence of burring during molding and high product yield after molding. The cured product has good heat coloration resistance and low Abbe's number. R11, R12, R15, and R16 represent a substituent and A represents an atomic group necessary for forming a cyclic structure.

Abstract translation: 包含具有芳环的（甲基）丙烯酸酯单体，由下述通式表示的非共轭亚乙烯基化合物和热或光自由基聚合引发剂的可固化树脂组合物使得可以制备固化产物 在成型期间最小化毛刺和在成型后产品产率高。 固化产物具有良好的耐着色性和低的阿贝数。 R11，R12，R15和R16表示取代基，A表示形成环状结构所需的原子团。

公开(公告)号：US20150015973A1

公开(公告)日：2015-01-15

申请号：US14498240

申请日：2014-09-26

Applicant: FUJIFILM Corporation

Inventor： Takayasu NAGAI ,  Naoyuki MOROOKA ,  Tatsuhiko OBAYASHI

IPC: B29D11/00 ,  G02B1/04 ,  B29C43/00

CPC classification number: B29D11/00403 ,  B29C39/10 ,  B29C43/003 ,  B29K2027/00 ,  B29K2033/08 ,  B29L2011/0016 ,  G02B1/041 ,  G02B1/043 ,  C08L33/10

Abstract: A compound lens produced by heating and pressing a semi-cured product of a curable resin composition containing a (meth)acrylate monomer, a non-conjugated vinylidene group-containing compound, and a photo-radical initiator and a transparent substrate arranged so as to be in contact with the semi-cured product in a state in which a molding die is filled with the semi-cured product and the transparent substrate, and obtaining a cured product by allowing the semi-cured product to be thermally polymerized, exhibits an excellent transfer property, a small number of bubble mixtures, and excellent heat resistance and crack resistance.

Abstract translation: 通过对包含（甲基）丙烯酸酯单体，非共轭亚乙烯基化合物和光自由基引发剂的固化性树脂组合物的半固化物进行加热加压而制造的复合透镜和透明基板， 在半固化物和透明基材填充成型模具的状态下与半固化物接触，通过使半固化物质热聚合得到固化物，显示出优异的 转移性能，少量泡沫混合物，以及优异的耐热性和抗裂性。

公开(公告)号：US20130131212A1

公开(公告)日：2013-05-23

申请号：US13744507

申请日：2013-01-18

Applicant: FUJIFILM Corporation

Inventor： Hiroaki MOCHIZUKI ,  Naoyuki MOROOKA ,  Rie OKUTSU ,  Tatsuhiko OBAYASHI

IPC: C08F265/04

CPC classification number: C08F265/04 ,  C08F220/18 ,  C08F220/28 ,  C08F220/40 ,  C08F265/06

Abstract: Disclosed is a curable resin composition comprising a polymer (A) that has a main chain comprising carbon atoms and a side chain having a polymerizing unsaturated linking group and has a cyclic structure in the main chain and/or the side chain, and a compound having a polymerizing unsaturated group. The curable resin composition has good optical characteristics, good heat resistance and good moldability.

Abstract translation: 本发明公开了一种固化性树脂组合物，其含有具有包含碳原子的主链的聚合物（A）和具有聚合性不饱和连接基且在主链和/或侧链中具有环状结构的侧链，以及具有 聚合不饱和基团。 该固化性树脂组合物具有良好的光学特性，良好的耐热性和良好的成型性。