公开(公告)号：US20180040824A1

公开(公告)日：2018-02-08

申请号：US15787990

申请日：2017-10-19

Applicant: FUJIFILM Corporation

Inventor： Seiya MASUDA ,  Yoshitaka KAMOCHI ,  Atsushi NAKAMURA

IPC: H01L51/00 ,  G03F7/16 ,  C08F220/28 ,  B32B27/30 ,  G03F7/038

Abstract: Provided are a laminate which includes an organic semiconductor film, a water-soluble resin layer, and a photosensitive resin layer and in which cracks are unlikely to occur; and a kit.The laminate includes a water-soluble resin layer containing a water-soluble resin and a photosensitive resin layer containing a photosensitive resin, which are provided in this order on an organic semiconductor film. The water-soluble resin layer and the photosensitive resin layer are adjacent to each other, the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater, and the photosensitive resin has a weight-average molecular weight of 30,000 or greater.

公开(公告)号：US20240032186A1

公开(公告)日：2024-01-25

申请号：US18475386

申请日：2023-09-27

Applicant: FUJIFILM Corporation

Inventor： Seiya MASUDA

IPC: H05K1/02 ,  H05K1/18 ,  H03H7/42 ,  H05K3/00

CPC classification number: H05K1/0216 ,  H05K1/181 ,  H03H7/425 ,  H05K3/00

Abstract: Provided are a structure having excellent shielding performance against electromagnetic waves in a frequency band of several tens of GHz, and a composition. Further, provided is a method for manufacturing a structure which makes it possible to easily manufacture a structure having excellent shielding performance against electromagnetic waves in a frequency band of several tens of GHz. The structure includes a substrate, a plurality of passive elements disposed on the substrate, and an electromagnetic wave absorbing film positioned at least in a region between the plurality of passive elements disposed on the substrate. The passive element is selected from the group consisting of an inductor and a balun. The electromagnetic wave absorbing film contains magnetic particles. In a case where a real part of a complex relative magnetic permeability μ of the electromagnetic wave absorbing film is defined as μ′ and a complex part of the complex relative magnetic permeability μ of the electromagnetic wave absorbing film is defined as μ″, the complex part μ″ of the complex relative magnetic permeability μ of the electromagnetic wave absorbing film satisfies any one of requirements 1 to 3. Requirement 1: μ″ at a frequency of 28 GHz is 0.1 to 10, Requirement 2: μ″ at a frequency of 47 GHz is 0.1 to 5, and Requirement 3: μ″ at a frequency of 60 GHz is 0.1 to 2.

公开(公告)号：US20250149235A1

公开(公告)日：2025-05-08

申请号：US19012205

申请日：2025-01-07

Applicant: FUJIFILM Corporation

Inventor： Seiya MASUDA

IPC: H01F27/32 ,  H01F1/22 ,  H01F41/04

Abstract: Provided are a structure having a high Q value and a small size, and a method for manufacturing a structure. The structure has a planar inductor disposed on a substrate, and further has a first magnetic body portion disposed on a substrate side with respect to the planar inductor with a first insulating layer interposed therebetween, a second magnetic body portion disposed on a side opposite to the substrate side with respect to the planar inductor with a second insulating layer interposed therebetween, and a third magnetic body portion disposed on a center portion of the planar inductor. At least a part of the first magnetic body portion, the second magnetic body portion, and the third magnetic body portion overlap with each other in a normal direction of the substrate, and the first magnetic body portion consists of a first center portion and a plurality of extending portions extending outward from the first center portion in an in-plane direction, or consists of a flat plate portion that covers at least a part of a region from a center of the planar inductor to the outside. The second magnetic body portion consists of a second center portion and a plurality of extending portions extending outward from the second center portion in an in-plane direction, or consists of a flat plate portion that covers at least a part of a region from the center of the planar inductor to the outside.

公开(公告)号：US20230216175A1

公开(公告)日：2023-07-06

申请号：US18184044

申请日：2023-03-15

Applicant: FUJIFILM Corporation

Inventor： Seiya MASUDA

IPC: H01Q1/22 ,  H01Q1/38 ,  H01L23/66

CPC classification number: H01Q1/2283 ,  H01Q1/38 ,  H01L23/66 ,  H01L2223/6677

Abstract: Provided are a method for producing a laminate, which enables easy production of a laminate having a magnetic pattern that absorbs electromagnetic waves transmitted from or received by an antenna; a method for producing an antenna-in-package; a laminate having a magnetic pattern that absorbs electromagnetic waves transmitted from or received by an antenna; and a composition. The method for producing a laminate is a method for producing a laminate including a step of applying a composition containing magnetic particles and a polymerizable compound onto a substrate on which an antenna is disposed to form a composition layer, and a step of subjecting the composition layer to an exposure treatment and a development treatment to form a magnetic pattern portion, in which the magnetic pattern portion is disposed on at least a part of a periphery of the antenna while being spaced apart from the antenna on the substrate.