公开(公告)号：US20180016471A1

公开(公告)日：2018-01-18

申请号：US15711226

申请日：2017-09-21

Applicant: FUJIFILM Corporation

Inventor： Yoshitaka KAMOCHI ,  Yu IWAI ,  Mitsuru SAWANO ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC: C09J7/00 ,  H01L21/683 ,  B32B38/00 ,  B32B37/10 ,  C09J5/04 ,  B32B37/12

CPC classification number: C09J7/00 ,  B32B7/12 ,  B32B27/00 ,  B32B37/10 ,  B32B37/12 ,  B32B38/0012 ,  B32B2307/54 ,  C09J5/04 ,  C09J201/00 ,  C09J2205/30 ,  H01L21/6836 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: To provide a laminate, a temporary adhesion composition, and a temporary adhesion film which are capable of making warpage less likely to occur even when a wafer is thin.Provided is a laminate including, sequentially being adjacent to each other: a first base material; a temporary adhesion film; and a second base material, in which a tensile elastic modulus E of the temporary adhesion film at 25° C. in conformity with JIS K 7161:1994 is in a range of 25 to 2000 MPa, a base material is peeled off by fixing any one of a first base material and a second base material of the laminate at 25° C. and pulling an end portion of the other base material up in a direction perpendicular to the surface of the other base material from an interface with the temporary adhesion film at a speed of 50 mm/min, and the force applied during the pulling is measured using a force gauge and the value is 0.33 N/mm or less.

公开(公告)号：US20180012751A1

公开(公告)日：2018-01-11

申请号：US15712595

申请日：2017-09-22

Applicant: FUJIFILM Corporation

Inventor： Yoshitaka KAMOCHI ,  Yu IWAI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC: H01L21/02 ,  H01L21/304 ,  C09J125/04 ,  C09J5/06 ,  C09J153/00 ,  C09J121/00 ,  C09J201/00

CPC classification number: H01L21/022 ,  C09J5/06 ,  C09J121/00 ,  C09J125/04 ,  C09J153/00 ,  C09J201/00 ,  H01L21/02057 ,  H01L21/02304 ,  H01L21/304 ,  H01L21/31133 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

公开(公告)号：US20180215965A1

公开(公告)日：2018-08-02

申请号：US15928691

申请日：2018-03-22

Applicant: FUJIFILM Corporation

Inventor： Kei FUKUHARA ,  Yoshitaka KAMOCHI ,  Mitsuru SAWANO

IPC: C09J11/06 ,  C09J133/10 ,  C09J175/04 ,  C09J171/00 ,  B32B7/12 ,  H01L21/683 ,  H01L21/304 ,  H01L21/768 ,  B32B43/00

Abstract: Provided are a temporary bonding material which is less likely to cause film unevenness and void formation while maintaining an adhesive force required for temporary bonding of a carrier substrate and a base material, and is easily peelable, a laminate, a method for manufacturing a laminate, a method for manufacturing a device substrate, and a method for manufacturing a semiconductor device.A temporary bonding material of the present invention includes a thermoplastic resin, a compound having a Si—O structure in an amount of 0.001% by mass or more and less than 8% by mass of the thermoplastic resin, and a solvent, in which an adhesive force of the temporary bonding material of an adhesive in which the solvent is removed from the temporary bonding material with respect to a silicon wafer is 1 to 15 N/m. In addition, a laminate using the temporary bonding material, a method for manufacturing a laminate, a method for manufacturing a device substrate, and a method for manufacturing a semiconductor device are disclosed.

公开(公告)号：US20160170303A1

公开(公告)日：2016-06-16

申请号：US15048187

申请日：2016-02-19

Applicant: FUJIFILM CORPORATION

Inventor： Yoshitaka KAMOCHI ,  Ichiro KOYAMA ,  Yu IWAI ,  Atsushi NAKAMURA

IPC: G03F7/11 ,  G03F7/038

CPC classification number: G03F7/11 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0382 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/325

Abstract: There is provided a laminate body which is capable of forming an excellent pattern on an organic semiconductor.A laminate body includes at least a water-soluble resin film and a resist film formed of a chemically amplified photosensitive resin composition on a surface of an organic semiconductor film in this order, in which the chemically amplified photosensitive resin composition contains a photoacid generator which is decomposed in an amount of 80% by mole or greater when exposed to light under the condition of 100 mJ/cm2 or greater at a wavelength of 365 nm, a mask pattern is formed by an exposed portion being hardly soluble in a developer containing an organic solvent, and the formed mask pattern is used as an etching mask.

Abstract translation: 提供能够在有机半导体上形成优异图案的层叠体。 层叠体依次包含至少一种水溶性树脂膜和由化学放大型感光性树脂组合物形成的抗蚀剂膜，其中化学增幅感光性树脂组合物含有光致酸产生剂，该光致酸性发生剂为 当在365nm的波长为100mJ / cm 2以上的条件下曝光时，以80摩尔％以上的量分解，掩模图案由几乎不溶于含有有机物的显影剂的露出部分形成 溶剂，并且将形成的掩模图案用作蚀刻掩模。

公开(公告)号：US20180040824A1

公开(公告)日：2018-02-08

申请号：US15787990

申请日：2017-10-19

Applicant: FUJIFILM Corporation

Inventor： Seiya MASUDA ,  Yoshitaka KAMOCHI ,  Atsushi NAKAMURA

IPC: H01L51/00 ,  G03F7/16 ,  C08F220/28 ,  B32B27/30 ,  G03F7/038

Abstract: Provided are a laminate which includes an organic semiconductor film, a water-soluble resin layer, and a photosensitive resin layer and in which cracks are unlikely to occur; and a kit.The laminate includes a water-soluble resin layer containing a water-soluble resin and a photosensitive resin layer containing a photosensitive resin, which are provided in this order on an organic semiconductor film. The water-soluble resin layer and the photosensitive resin layer are adjacent to each other, the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater, and the photosensitive resin has a weight-average molecular weight of 30,000 or greater.

公开(公告)号：US20160168422A1

公开(公告)日：2016-06-16

申请号：US15047945

申请日：2016-02-19

Applicant: FUJIFILM Corporation

Inventor： Yu IWAI ,  Ichiro KOYAMA ,  Yoshitaka KAMOCHI

IPC: C09J4/06 ,  C09D169/00 ,  H01L21/683 ,  C09D145/00 ,  C09J4/00 ,  C09D181/06 ,  C09D125/06

CPC classification number: C09J4/06 ,  B32B3/08 ,  B32B7/12 ,  B32B27/06 ,  B32B27/281 ,  B32B27/288 ,  B32B27/36 ,  B32B2457/00 ,  B32B2457/14 ,  C08F222/1006 ,  C08F2222/1013 ,  C08F2222/1026 ,  C08F2222/104 ,  C08F2222/108 ,  C09D125/06 ,  C09D145/00 ,  C09D169/00 ,  C09D181/06 ,  C09J4/00 ,  C09J201/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/81 ,  H01L2224/95

Abstract: Provided are a laminate capable of providing a temporary support for a member to be treated by a strongly adhesive force when the member to be treated is subjected to a mechanical or chemical treatment, and of easily releasing the temporary support for the treated member while not damaging the treated member, in which the TTV of the treated member is excellent; a composition for forming a protective layer; a composition for forming an adhesive layer; and a kit.The laminate has, on a support (A), an adhesive layer having a softening point of 250° C. or higher (B), a protective layer (C), and a device wafer (D) in this order, in which the adhesive layer (B) is a cured product of an adhesive layer precursor and the adhesive layer precursor has a polymerizable compound (b-1).

Abstract translation: 本发明提供一种层叠体，当待处理构件进行机械或化学处理时，能够通过强粘合力提供待处理构件的临时支撑，并且容易地释放处理构件的临时支撑件而不损坏 被处理部件的TTV优良的被处理部件; 用于形成保护层的组合物; 用于形成粘合剂层的组合物; 和一个工具包。 层压体在支撑体（A）上具有软化点为250℃以上的粘合剂层（B），保护层（C）和装置晶片（D），其中， 粘合剂层（B）是粘合剂层前体的固化物，粘合剂层前体具有聚合性化合物（b-1​​）。

公开(公告)号：US20160167337A1

公开(公告)日：2016-06-16

申请号：US15052122

申请日：2016-02-24

Applicant: FUJIFILM Corporation

Inventor： Ichiro KOYAMA ,  Yu IWAI ,  Yoshitaka KAMOCHI

IPC: B32B7/06 ,  H01L21/683

CPC classification number: B32B7/06 ,  B32B7/12 ,  B32B9/00 ,  B32B15/08 ,  B32B25/20 ,  B32B27/08 ,  B32B27/22 ,  B32B27/283 ,  B32B27/302 ,  B32B27/304 ,  B32B27/365 ,  B32B2250/02 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/51 ,  B32B2307/748 ,  B32B2457/00 ,  B32B2457/14 ,  H01L21/02057 ,  H01L21/31133 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: Provided are a temporary bonding layer laminate for producing a semiconductor device, which can reliably and easily provide a temporary support for the device wafer when the device wafer is subjected to a mechanical or chemical treatment and can easily provide a release from the temporary support for the device wafer while not damaging the device wafer even after undergoing a process at a high temperature; and a composition for forming a protective layer, a composition for forming a release layer, and a kit, each of which is used for the production of the laminate.The laminate has a device wafer, a protective layer, a release layer, and a support substrate in this order, in which the protective layer is in contact only with the device wafer and the release layer, the release layer is in contact only with the protective layer and the support substrate, and the release layer contains a fluorine atom and/or a silicon atom.

Abstract translation: 提供一种用于制造半导体器件的临时接合层层压体，当器件晶片经受机械或化学处理时，其可以可靠且容易地为器件晶片提供临时支撑，并且可以容易地从临时支撑件释放 即使在高温下进行处理也不会损坏器件晶片; 和用于形成保护层的组合物，用于形成剥离层的组合物和试剂盒，其用于制备层压体。 该层压体依次具有器件晶片，保护层，剥离层和支撑基板，其中保护层仅与器件晶片和释放层接触，释放层仅与 保护层和支撑基板，剥离层含有氟原子和/或硅原子。

公开(公告)号：US20170198176A1

公开(公告)日：2017-07-13

申请号：US15468288

申请日：2017-03-24

Applicant: FUJIFILM Corporation

Inventor： Yoshitaka KAMOCHI ,  Ichiro KOYAMA ,  Yu IWAI ,  Atsushi NAKAMURA ,  Mitsuru SAWANO

IPC: C09J11/06 ,  H01L21/683 ,  C09J153/02 ,  C09J7/00 ,  B32B25/04 ,  B32B7/12

CPC classification number: C09J11/06 ,  B32B3/08 ,  B32B7/04 ,  B32B7/06 ,  B32B7/12 ,  B32B9/043 ,  B32B15/06 ,  B32B25/04 ,  B32B25/08 ,  B32B25/12 ,  B32B25/14 ,  B32B25/16 ,  B32B25/18 ,  B32B25/20 ,  B32B27/06 ,  B32B27/08 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/285 ,  B32B27/286 ,  B32B27/304 ,  B32B27/306 ,  B32B27/325 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/42 ,  B32B2250/03 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/51 ,  B32B2307/58 ,  B32B2307/584 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2457/14 ,  C08J3/092 ,  C08J5/18 ,  C08J2309/06 ,  C08J2353/02 ,  C09J7/00 ,  C09J7/10 ,  C09J121/00 ,  C09J153/025 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2453/00 ,  H01L21/02 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer.This composition includes an elastomer having a 5% thermal mass reduction temperature of 375° C. or higher when heated at an elevation rate of 20° C./min from 25° C., a solvent represented by the following General Formula (1) and having a boiling point of 160° C. or higher, and a solvent having a boiling point of lower than 120° C. In General Formula (1), R1 to R6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group.

公开(公告)号：US20160240816A1

公开(公告)日：2016-08-18

申请号：US15139989

申请日：2016-04-27

Applicant: FUJIFILM Corporation

Inventor： Kazuyoshi MIZUTANI ,  Yu IWAI ,  Ichiro KOYAMA ,  Yoshitaka KAMOCHI

IPC: H01L51/52 ,  G03F7/11 ,  G03F7/004 ,  G03F7/039 ,  H01L51/42 ,  B32B27/08

CPC classification number: H01L51/5253 ,  B32B27/08 ,  B32B2307/4026 ,  B32B2307/54 ,  B32B2457/00 ,  B32B2457/14 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/0382 ,  G03F7/039 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/325 ,  H01L51/4253 ,  H01L51/448 ,  Y02E10/549 ,  Y02P70/521

Abstract: Provided are a laminate which is capable of forming an excellent organic semiconductor pattern, a kit for manufacturing an organic semiconductor, which is used to manufacture such a laminate, and a resist composition for manufacturing an organic semiconductor, which is used for the kit for manufacturing an organic semiconductor.The laminate includes an organic semiconductor film, a protective film on the organic semiconductor film, and a resist film on the protective film, in which the resist film is formed of a photosensitive resin composition that contains a photoacid generator (A) which generates an organic acid of which a pKa of the generated acid is −1 or less and a resin (B) which reacts with an acid generated by the photoacid generator so that the rate of dissolution in a developer containing an organic solvent is decreased.

Abstract translation: 提供能够形成优异的有机半导体图案的层压体，用于制造这种层压体的用于制造有机半导体的套件以及用于制造用于制造的套件的有机半导体用抗蚀剂组合物 有机半导体。 层压体包括有机半导体膜，有机半导体膜上的保护膜和保护膜上的抗蚀剂膜，其中抗蚀剂膜由包含产生有机物的光致酸产生剂（A）的光敏树脂组合物形成， 产生酸的pKa为-1以下的酸和与光产酸剂生成的酸反应的树脂（B），使得含有有机溶剂的显影剂的溶解率降低。

公开(公告)号：US20150221881A1

公开(公告)日：2015-08-06

申请号：US14689216

申请日：2015-04-17

Applicant: FUJIFILM CORPORATION

Inventor： Yu IWAI ,  Atsushi NAKAMURA ,  Yoshitaka KAMOCHI ,  Masafumi YOSHIDA

IPC: H01L51/00 ,  C09D101/00 ,  G03F7/20 ,  C09D105/00

CPC classification number: H01L51/0093 ,  C09D101/00 ,  C09D105/00 ,  G03F7/027 ,  G03F7/0388 ,  G03F7/0392 ,  G03F7/11 ,  G03F7/20 ,  G03F7/325 ,  H01L21/02118 ,  H01L21/3065 ,  H01L51/004 ,  H01L51/107 ,  H01L51/448 ,  H01L51/5253 ,  H01L51/56

Abstract: There is provided a resin composition for use in formation of a protective film to protect a substrate or a film formed on the substrate, from a developer containing an organic solvent to be used for development in pattern formation, and which contains two or more kinds of resins in which their main chain structures having a hydroxyl group are different, and contains water, a pattern forming method using the resin composition, and layered products comprising a substrate, an organic semiconductor film on the substrate, and a protective film comprising two or more kinds of resins in which their main chain structures having a hydroxyl group are different, on the organic semiconductor film.

Abstract translation: 提供一种用于形成保护膜的树脂组合物，用于保护基板或形成在基板上的膜与图案形成中用于显影的有机溶剂的显影剂，并且其包含两种或更多种 具有羟基的主链结构不同且含有水的树脂，使用该树脂组合物的图案形成方法，以及包含基板，基板上的有机半导体膜以及包含两个以上的保护膜的层叠体 在有机半导体膜上具有羟基的主链结构不同的树脂种类。