公开(公告)号：US20220342300A1

公开(公告)日：2022-10-27

申请号：US17707373

申请日：2022-03-29

Applicant: FUJIFILM Corporation

Inventor： Aya NAKAYAMA ,  Katsuyuki NUKUI ,  Yuya MOTOMURA ,  Toru OGAWA ,  Shinichi NAKAHIRA

IPC: G03F7/004 ,  C09D5/24 ,  C09D4/00 ,  C09D133/06 ,  C09D7/61 ,  G03F7/32 ,  H01B3/42 ,  H01B5/14 ,  H01B1/02 ,  G06F3/044

Abstract: A manufacturing method for a conductive substrate, with which a conductive substrate including a substrate and a conductive thin wire arranged on the substrate are manufactured, includes in the following order, a step 1 of forming a thin wire containing a metal on the substrate; a step 2 of bringing the thin wire into contact with a solution containing an organic acid; and a step 3 of subjecting the thin wire to a plating treatment to form a conductive thin wire.