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公开(公告)号:US20240166948A1
公开(公告)日:2024-05-23
申请号:US18408579
申请日:2024-01-10
IPC分类号: C09K13/08 , H01L21/306
CPC分类号: C09K13/08 , H01L21/30604
摘要: Provided is a semiconductor etching solution having a large etching ratio of SiGe relative to Si when an object containing Si and SiGe is treated and having excellent storage stability. The semiconductor etching solution includes: a fluoride ion source; a carboxylic acid; a percarboxylic acid; hydrogen peroxide; and bromide ions, and a content of the bromide ions is less than 500 mass ppm with respect to a total mass of the semiconductor etching solution.