公开(公告)号：US20220247353A1

公开(公告)日：2022-08-04

申请号：US17665492

申请日：2022-02-05

Applicant: FUTUREWEI TECHNOLOGIES, INC.

Inventor： Michael Bushman ,  James Caldwell

IPC: H03B5/12 ,  H03L7/099 ,  G06F1/10 ,  H03F1/38

Abstract: A resonant tank includes a first capacitor formed on a semiconductor substrate, a first inductor formed on the semiconductor substrate, a second capacitor formed on the semiconductor substrate, and a second inductor formed on the semiconductor substrate. The first capacitor, the first inductor, the second capacitor, and the second inductor are connected in a ring configuration, with each capacitor connected between a pair of the inductors and with each inductor connected between a pair of the capacitors. An amplifier circuit is coupled to the resonant tank and configured to amplify a signal in the resonant tank.

公开(公告)号：US10924059B2

公开(公告)日：2021-02-16

申请号：US16029905

申请日：2018-07-09

Applicant: Futurewei Technologies, Inc.

Inventor： Michael Bushman ,  James Caldwell

IPC: H03B5/12 ,  H03L7/099 ,  G06F1/10

Abstract: A resonant tank includes a first capacitor formed on a semiconductor substrate, a first inductor formed on the semiconductor substrate, a second capacitor formed on the semiconductor substrate, and a second inductor formed on the semiconductor substrate. The first capacitor, the first inductor, the second capacitor, and the second inductor are connected in a ring configuration, with each capacitor connected between a pair of the inductors and with each inductor connected between a pair of the capacitors. An amplifier circuit is coupled to the resonant tank and configured to amplify a signal in the resonant tank.

公开(公告)号：US11515838B2

公开(公告)日：2022-11-29

申请号：US17665492

申请日：2022-02-05

Applicant: FUTUREWEI TECHNOLOGIES, INC.

Inventor： Michael Bushman ,  James Caldwell

IPC: H03B5/12 ,  H03L7/099 ,  G06F1/10 ,  H03F1/38

Abstract: A resonant tank includes a first capacitor formed on a semiconductor substrate, a first inductor formed on the semiconductor substrate, a second capacitor formed on the semiconductor substrate, and a second inductor formed on the semiconductor substrate. The first capacitor, the first inductor, the second capacitor, and the second inductor are connected in a ring configuration, with each capacitor connected between a pair of the inductors and with each inductor connected between a pair of the capacitors. An amplifier circuit is coupled to the resonant tank and configured to amplify a signal in the resonant tank.

公开(公告)号：US20210242832A1

公开(公告)日：2021-08-05

申请号：US17176084

申请日：2021-02-15

Applicant: FUTUREWEI TECHNOLOGIES, INC.

Inventor： Michael Bushman ,  James Caldwell

IPC: H03B5/12 ,  H03L7/099 ,  G06F1/10

Abstract: A resonant tank includes a first capacitor formed on a semiconductor substrate, a first inductor formed on the semiconductor substrate, a second capacitor formed on the semiconductor substrate, and a second inductor formed on the semiconductor substrate. The first capacitor, the first inductor, the second capacitor, and the second inductor are connected in a ring configuration, with each capacitor connected between a pair of the inductors and with each inductor connected between a pair of the capacitors. An amplifier circuit is coupled to the resonant tank and configured to amplify a signal in the resonant tank.

公开(公告)号：US20200014330A1

公开(公告)日：2020-01-09

申请号：US16029905

申请日：2018-07-09

Applicant: Futurewei Technologies, Inc.

Inventor： Michael Bushman ,  James Caldwell

IPC: H03B5/12 ,  H03L7/099

Abstract: A resonant tank includes a first capacitor formed on a semiconductor substrate, a first inductor formed on the semiconductor substrate, a second capacitor formed on the semiconductor substrate, and a second inductor formed on the semiconductor substrate. The first capacitor, the first inductor, the second capacitor, and the second inductor are connected in a ring configuration, with each capacitor connected between a pair of the inductors and with each inductor connected between a pair of the capacitors. An amplifier circuit is coupled to the resonant tank and configured to amplify a signal in the resonant tank.

公开(公告)号：US11271524B2

公开(公告)日：2022-03-08

申请号：US17176084

申请日：2021-02-15

Applicant: FUTUREWEI TECHNOLOGIES, INC.

Inventor： Michael Bushman ,  James Caldwell

IPC: H03B5/12 ,  H03L7/099 ,  G06F1/10 ,  H03F1/38

Abstract: A resonant tank includes a first capacitor formed on a semiconductor substrate, a first inductor formed on the semiconductor substrate, a second capacitor formed on the semiconductor substrate, and a second inductor formed on the semiconductor substrate. The first capacitor, the first inductor, the second capacitor, and the second inductor are connected in a ring configuration, with each capacitor connected between a pair of the inductors and with each inductor connected between a pair of the capacitors. An amplifier circuit is coupled to the resonant tank and configured to amplify a signal in the resonant tank.