-
公开(公告)号：US11296266B2
公开(公告)日：2022-04-05
申请号：US16696811
申请日：2019-11-26
IPC分类号： H01L33/62 , G02B27/01 , H01L25/075 , H01L33/00 , H01L33/58
摘要： In a flip-chip LED assembly having an array of LEDs formed on the same substrate, different LEDs of the array have different distances to the n-contacts of the assembly. This may cause current crowding as current has to spread from the n-contacts through the substrate to each the farthest LEDs of the LED array, requiring LEDs that are farther away to be driven with a higher voltage in order to receive a desired amount of current. To spread current more evenly through the LED assembly and reduce a voltage difference between the closest and farthest LEDs of the array, a current spreading layer having a conductive material (e.g., a conductive oxide) is formed on a surface of the substrate of the LED assembly. The current spreading layer may be a bulk layer or be patterned to increase light extraction from the LEDs of the array.
-
公开(公告)号：US11250810B2
公开(公告)日：2022-02-15
申请号：US16891908
申请日：2020-06-03
摘要： In one embodiment, a computing system may receive a target color and a propagated error for a pixel location. The system may determine an error-modified target color for the pixel location based on the received target color and the propagated error. The system may identify, based on a location of the error-modified target color in a three-dimensional color space, a subset of pre-determined colors in the three-dimensional color space. The error-modified target color may correspond to a weighted combination of the subset of pre-determined colors. The system may determine a pixel color for the pixel location based on the subset of pre-determined colors and respective weights associated with the subset of pre-determined colors. The system may determine, based on the pixel color, driving signals for light-emitting elements associated with the pixel location. The system may output the driving signals to control the light-emitting elements associated with the pixel location.
-
公开(公告)号：US11209676B2
公开(公告)日：2021-12-28
申请号：US16849853
申请日：2020-04-15
发明人： Matthieu Charles Raoul Leibovici , Jasmine Soria Sears , Christophe Antoine Hurni , Nathan Matsuda , Guohua Wei , Yu Shi , John Goward
摘要： An optical assembly is configured to receive visible scene light at a backside of the optical assembly and to direct the visible scene light on an optical path toward the eyeward side. The optical assembly also includes a dimming layer disposed on the optical path, where the dimming layer includes a photochromic material that is configured to darken in response to exposure to a range of light wavelengths. An activation layer, included in the optical assembly, is also disposed on the optical path and includes an in-field dimmer. The in-field dimmer is configured to selectively emit an activation light within the range of light wavelengths to activate a darkening of a region of the dimming layer to dim the visible scene light within the region.
-
公开(公告)号：US20210383771A1
公开(公告)日：2021-12-09
申请号：US16891908
申请日：2020-06-03
摘要： In one embodiment, a computing system may receive a target color and a propagated error for a pixel location. The system may determine an error-modified target color for the pixel location based on the received target color and the propagated error. The system may identify, based on a location of the error-modified target color in a three-dimensional color space, a subset of pre-determined colors in the three-dimensional color space. The error-modified target color may correspond to a weighted combination of the subset of pre-determined colors. The system may determine a pixel color for the pixel location based on the subset of pre-determined colors and respective weights associated with the subset of pre-determined colors. The system may determine, based on the pixel color, driving signals for light-emitting elements associated with the pixel location. The system may output the driving signals to control the light-emitting elements associated with the pixel location.
-
公开(公告)号：US20210159376A1
公开(公告)日：2021-05-27
申请号：US16696811
申请日：2019-11-26
IPC分类号： H01L33/62 , H01L25/075 , H01L33/58 , H01L33/00 , G02B27/01
摘要： In a flip-chip LED assembly having an array of LEDs formed on the same substrate, different LEDs of the array have different distances to the n-contacts of the assembly. This may cause current crowding as current has to spread from the n-contacts through the substrate to each the farthest LEDs of the LED array, requiring LEDs that are farther away to be driven with a higher voltage in order to receive a desired amount of current. To spread current more evenly through the LED assembly and reduce a voltage difference between the closest and farthest LEDs of the array, a current spreading layer having a conductive material (e.g., a conductive oxide) is formed on a surface of the substrate of the LED assembly. The current spreading layer may be a bulk layer or be patterned to increase light extraction from the LEDs of the array.
-
公开(公告)号：US11139417B1
公开(公告)日：2021-10-05
申请号：US16696820
申请日：2019-11-26
摘要： In a flip-chip LED assembly having an array of LEDs formed on the same substrate, different LEDs of the array have different distances to the n-contacts of the assembly. This may cause current crowding as current has to spread from the n-contacts through the substrate to each the farthest LEDs of the LED array, requiring LEDs that are farther away to be driven with a higher voltage in order to receive a desired amount of current. To spread current more evenly through the LED assembly and reduce a voltage difference between the closest and farthest LEDs of the array, one or more additional n-contacts are formed within the LED array. In some embodiments, the n-contacts may replace a pixel of the LED array. In other embodiments, one or more p-contacts of the LED array are resized or repositioned to accommodate the additional n-contacts without sacrificing pixels of the LED array.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.014 秒)
