Backplate for head-mounted displays

    公开(公告)号:US10859843B1

    公开(公告)日:2020-12-08

    申请号:US16594045

    申请日:2019-10-06

    IPC分类号: G02B27/01

    摘要: A backplate for a head-mounted display (HMD) is disclosed. The backplate provides structural support as well as thermal cooling for components coupled to the backplate. The backplate includes a plurality of mounting regions that are used to couple components to the backplate. The mounting regions may include camera mounting regions (e.g., for inside-out tracking), an inertial measurement unit (IMU) mounting region, circuit board mounting regions, heat pipe mounting region, and a fan mounting region. The mounting regions may be specific to the component. In various embodiments, the backplate is a single diecast metal plate that includes the mounting regions designed to provide certain levels of thermal management, stiffness, and conductivity (e.g., ground) for the HMD.