公开(公告)号：US07129025B2

公开(公告)日：2006-10-31

申请号：US10438527

申请日：2003-05-14

申请人： Fan-Gang Tseng ,  Yun-Ju Chuang

发明人： Fan-Gang Tseng ,  Yun-Ju Chuang

IPC分类号： G03C5/00

CPC分类号： B81C1/00 ,  G03F7/0035 ,  G03F7/0037 ,  G03F7/20 ,  G03F7/203 ,  G03F7/7035 ,  G03F7/70416 ,  H01L21/0276 ,  Y10S430/151

摘要： A fabrication method of three-dimensional microstructures is to fabricate a real 3D microstructure. First, a substrate is coated with an anti-reflection layer to absorb reflected exposure light, and then the anti-reflection layer is overlaid with a first thick photoresist. After having been fully exposed by a first photo mask, a predetermined exposure depth of the first thick photoresist is achieved by a second photo mask and dosage-controlled UV exposure. If the unexposed areas of the first thick photoresist are released during a development step, a single-layer microstructure is created. Inversely, a multi-layered microstructure can be obtained simply by repeating the process described above. After all layers are laminated on the substrate, all unexposed areas of the all thick photoresist layers are released and connected to each other during a development step.