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1.
公开(公告)号:US20120251382A1
公开(公告)日:2012-10-04
申请号:US13243754
申请日:2011-09-23
申请人: Feng Peng , Baoping Xia , Jianping Liu , Bin Feng , Changshun Zheng , Wenjian Liu
发明人: Feng Peng , Baoping Xia , Jianping Liu , Bin Feng , Changshun Zheng , Wenjian Liu
IPC分类号: C22C9/04
摘要: A lead-free free-cutting corrosion-resistant silicon-bismuth brass alloy, including the following: between 60.0 and 65.0 wt % of Cu, between 0.6 and 1.8 wt % of Si, between 0.2 and 1.5 wt % of Bi, between 0.02 and 0.5 wt % of Al, less than 1.5 wt % of Ni+Mn+Sn, between 0.01 and 0.5 wt % of La—Ce alloy, between 0.002 and 0.02 wt % of B, with the remainder being Zn and inevitable impurities, wherein the total amount of impurities are no more than 0.5 wt %.
摘要翻译: 一种无铅自由切削耐腐蚀的铋铋黄铜合金,其包括:Cu的60.0和65.0重量%,Si的0.6-1.8重量%,Bi的0.2和1.5重量%之间,0.02和 0.5重量%的Al,小于1.5重量%的Ni + Mn + Sn,0.01〜0.5重量%的La-Ce合金,0.002〜0.02重量%的B,余量为Zn和不可避免的杂质,其中 杂质总量不超过0.5重量%。
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2.
公开(公告)号:US08366841B2
公开(公告)日:2013-02-05
申请号:US13243754
申请日:2011-09-23
申请人: Feng Peng , Baoping Xia , Jianping Liu , Bin Feng , Changshun Zheng , Wenjian Liu
发明人: Feng Peng , Baoping Xia , Jianping Liu , Bin Feng , Changshun Zheng , Wenjian Liu
IPC分类号: C22C9/04
摘要: A lead-free free-cutting corrosion-resistant silicon-bismuth brass alloy, including the following: between 60.0 and 65.0 wt % of Cu, between 0.6 and 1.8 wt % of Si, between 0.2 and 1.5 wt % of Bi, between 0.02 and 0.5 wt % of Al, less than 1.5 wt % of Ni+Mn+Sn, between 0.01 and 0.5 wt % of La—Ce alloy, between 0.002 and 0.02 wt % of B, with the remainder being Zn and inevitable impurities, wherein the total amount of impurities are no more than 0.5 wt %.
摘要翻译: 一种无铅自由切削耐腐蚀的铋铋黄铜合金,其包括:Cu的60.0和65.0重量%,Si的0.6-1.8重量%,Bi的0.2和1.5重量%之间,0.02和 0.5重量%的Al,小于1.5重量%的Ni + Mn + Sn,0.01〜0.5重量%的La-Ce合金,0.002〜0.02重量%的B,余量为Zn和不可避免的杂质,其中 杂质总量不超过0.5重量%。
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公开(公告)号:US20120184508A1
公开(公告)日:2012-07-19
申请号:US13347718
申请日:2012-01-11
申请人: Wenjian Liu , Kin-Chun Luk , Xiaohu Zhang
发明人: Wenjian Liu , Kin-Chun Luk , Xiaohu Zhang
IPC分类号: A61K31/695 , C07D487/04 , C07F7/10 , A61K31/5377 , A61K31/519
CPC分类号: C07D487/04
摘要: Compounds of formula and pharmaceutically acceptable salts thereof are described, as well as the pharmaceutical compositions containing said compounds and their pharmaceutically acceptable salts, and the use of said compounds and pharmaceutical compositions for the treatment, control or amelioration of proliferative diseases, including cancer, Down syndrome or early onset Alzheimer's disease.
摘要翻译: 本发明描述了式及其药学上可接受的盐的化合物,以及含有所述化合物及其药学上可接受的盐的药物组合物,以及所述化合物和药物组合物用于治疗,控制或改善增殖性疾病(包括癌症)Down 综合征或早发性阿尔茨海默氏病。
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公开(公告)号:US08362023B2
公开(公告)日:2013-01-29
申请号:US13347718
申请日:2012-01-11
申请人: Wenjian Liu , Kin-Chun Luk , Xiaohu Zhang
发明人: Wenjian Liu , Kin-Chun Luk , Xiaohu Zhang
IPC分类号: A61K31/519 , C07D487/04 , A61P35/04 , A61P25/28
CPC分类号: C07D487/04
摘要: Compounds of formula and pharmaceutically acceptable salts thereof are described, as well as the pharmaceutical compositions containing said compounds and their pharmaceutically acceptable salts, and the use of the compounds and pharmaceutical compositions for the treatment, control or amelioration of proliferative diseases, including cancer, Down syndrome or early onset Alzheimer's disease.
摘要翻译: 本发明描述了式及其药学上可接受的盐的化合物,以及含有所述化合物及其药学上可接受的盐的药物组合物,以及该化合物和药物组合物用于治疗,控制或改善增殖性疾病(包括癌症)Down 综合征或早发性阿尔茨海默氏病。
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