INTEGRATED CARRIER FOR MICROFLUIDIC DEVICE
    1.
    发明申请
    INTEGRATED CARRIER FOR MICROFLUIDIC DEVICE 审中-公开
    集成载体微流控器件

    公开(公告)号:US20140087973A1

    公开(公告)日:2014-03-27

    申请号:US14029676

    申请日:2013-09-17

    Inventor: Yusuf D. Amin

    Abstract: An injection molding method of fabricating a carrier for holding a microfluidic device can form all of the desired features of such a carrier, including wells, channels and ports having smaller dimensions and greater density than previously achieved, while reducing or avoiding fracturing and the need for drilling the substrate to form certain features, in particular the ports. The carrier includes a substrate with a plurality of wells, each well defining a volume of between 0.1 μl and 100 μl; a plurality of channels within the substrate wherein each well is in fluid communication with at least one of the plurality of channels; a plurality of ports within the carrier substrate wherein each port is for coupling with regions in the carrier substrate adapted to receive fluids or pressure; and a receiving portion for receiving a microfluidic device and placing the microfluidic device in fluid communication with the plurality of wells. The carrier has a polymeric composition and/or an array of structural features achieved via the injection molding fabrication technique that enhance its performance and compatibility with existing instrumentation.

    Abstract translation: 用于制造用于保持微流体装置的载体的注射成型方法可以形成这种载体的所有期望特征,包括具有比以前实现的更小尺寸和更大密度的孔,通道和端口,同时减少或避免压裂和 钻基板以形成某些特征,特别是端口。 载体包括具有多个孔的底物,每个孔限定0.1μl和100μl之间的体积; 衬底内的多个通道,其中每个阱与所述多个通道中的至少一个流体连通; 载体衬底内的多个端口,其中每个端口用于与适于接收流体或压力的载体衬底中的区域耦合; 以及用于接收微流体装置并将微流体装置与多个孔流体连通的接收部分。 载体具有聚合物组合物和/或通过注射成型制造技术实现的结构特征阵列,其增强其性能和与现有仪器的兼容性。

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