公开(公告)号：US11754511B2

公开(公告)日：2023-09-12

申请号：US16195426

申请日：2018-11-19

Applicant: FormFactor, Inc.

Inventor： Jens Fiedler ,  Sebastian Gießmann

IPC: H01L27/14 ,  H01L27/146 ,  G01N21/956 ,  H01L21/67 ,  G06T7/00 ,  G06F3/0481 ,  H01L25/16 ,  G06V10/75

CPC classification number: H01L27/14601 ,  G01N21/956 ,  G06F3/0481 ,  G06T7/001 ,  H01L21/67005 ,  H01L25/167 ,  G06V10/7515 ,  G09G2340/12

Abstract: The invention relates to a method for optically representing electronic semiconductor components 2 on structural units 1 as used for contacting semiconductor components, and to a device which can be used for this purpose. The aim of the invention is to improve navigation on the structural unit 1. Regarding the structural unit 1 provided on a holding surface 19 of a holding device 18, a graphical representation 4 of the structural unit 1 or its semiconductor component 2, or of a section thereof, is provided, and a live image 3 of the semiconductor component 2 is displayed on a first display unit 33. A first graphical representation 4 is also displayed on the first display unit 33 in such a way that elements of the first graphical representation 4, referred to as overlays 5, superimpose the live image 3. The first graphical representation 4 is synchronized with the live image 3 in a computer-aided manner such that at least one overlay 5 corresponds to the associated element of the live image 3.