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公开(公告)号:US11754511B2
公开(公告)日:2023-09-12
申请号:US16195426
申请日:2018-11-19
Applicant: FormFactor, Inc.
Inventor: Jens Fiedler , Sebastian Gießmann
IPC: H01L27/14 , H01L27/146 , G01N21/956 , H01L21/67 , G06T7/00 , G06F3/0481 , H01L25/16 , G06V10/75
CPC classification number: H01L27/14601 , G01N21/956 , G06F3/0481 , G06T7/001 , H01L21/67005 , H01L25/167 , G06V10/7515 , G09G2340/12
Abstract: The invention relates to a method for optically representing electronic semiconductor components 2 on structural units 1 as used for contacting semiconductor components, and to a device which can be used for this purpose. The aim of the invention is to improve navigation on the structural unit 1. Regarding the structural unit 1 provided on a holding surface 19 of a holding device 18, a graphical representation 4 of the structural unit 1 or its semiconductor component 2, or of a section thereof, is provided, and a live image 3 of the semiconductor component 2 is displayed on a first display unit 33. A first graphical representation 4 is also displayed on the first display unit 33 in such a way that elements of the first graphical representation 4, referred to as overlays 5, superimpose the live image 3. The first graphical representation 4 is synchronized with the live image 3 in a computer-aided manner such that at least one overlay 5 corresponds to the associated element of the live image 3.