公开(公告)号：US20040088670A1

公开(公告)日：2004-05-06

申请号：US10693484

申请日：2003-10-23

Applicant: FormFactor, Inc.

Inventor： Mac Stevens ,  Yves Parent

IPC: G06F017/50

CPC classification number: G06F17/5077

Abstract: An initial graph of nodes is created within a routing space, and the number and locations of the nodes in the graph are adjusted. Links are created between nodes of the graph, and traces between specified nodes are created through the linked graph.

公开(公告)号：US20030070153A1

公开(公告)日：2003-04-10

申请号：US09938789

申请日：2001-08-24

Applicant: FormFactor, Inc.

Inventor： Mac Stevens ,  Yves Parent

IPC: G06F017/50

CPC classification number: G06F17/5077

Abstract: An initial graph of nodes is created within a routing space, and the number and locations of the nodes in the graph are adjusted. Links are created between nodes of the graph, and traces between specified nodes are created through the linked graph.

Abstract translation: 在路由空间内创建节点的初始图，并调整图中节点的数量和位置。 在图的节点之间创建链接，并通过链接图创建指定节点之间的跟踪。

公开(公告)号：US20030055736A1

公开(公告)日：2003-03-20

申请号：US09954617

申请日：2001-09-17

Applicant: FormFactor, Inc.

Inventor： Benjamin N. Eldridge ,  Mark W. Brandemuehl ,  Stefan Graef ,  Yves Parent

IPC: G06F017/60

CPC classification number: G01R3/00 ,  G01R1/073 ,  G01R1/07342 ,  G06Q30/0609 ,  G06Q30/0621 ,  G06Q30/0633 ,  G06Q50/188

Abstract: A method and system for designing a probe card from data provided by prospective customers via the Internet is provided. Design specifications are entered into the system by prospective customers and compiled into a database. The collective feasibility of each set of design specifications is determined by an automated computer system and communicated to the prospective customer. If feasible, additional software enables prospective customers to create verification packages according to their respective design specifications. These verification packages further consist of drawing files visually describing the final design and verification files confirming wafer bonding pad data. Verification packages are reviewed and forwarded to an applications engineer after customer approval. An interactive simulation of probe card performance is also provided. Data on probe card performance is incorporated into an overall modeling exercise, which includes not only the probe card, but data on the device(s) under test and wafer, as well as data on automated test equipment.