公开(公告)号：US06265328B1

公开(公告)日：2001-07-24

申请号：US09239477

申请日：1999-01-28

申请人： Francois J. Henley ,  Nathan Cheung ,  William G. Eng ,  Igor J. Malik

发明人： Francois J. Henley ,  Nathan Cheung ,  William G. Eng ,  Igor J. Malik

IPC分类号： B05C1102

CPC分类号： H01L21/67092 ,  H01L21/6708 ,  H01L21/6715

摘要： The present invention provides an apparatus (400) (500) for abating edge material from a substrate, e.g., SOI. The apparatus includes, among other elements, a housing and a rotatable member (401) coupled to the housing. The rotatable member is a susceptor, which is relatively flat for securing a substrate. A movable dispensing head (421) is coupled to the housing and is overlying the rotatable member. The movable dispensing head (421) is operable to emit a stream of directed fluid to one or more locations of the susceptor. The apparatus also includes a fluid source, which is coupled to the movable dispensing head. The fluid source provides fluid to ablate material from the substrate.

摘要翻译： 本发明提供一种用于从衬底（例如SOI）减缓边缘材料的装置（400）（500）。 除了其它元件之外，该装置包括壳体和联接到壳体的可旋转构件（401）。 可旋转构件是一个基座，它相对平坦，用于固定基板。 可移动分配头（421）联接到壳体并且覆盖在可旋转构件上。 可移动分配头（421）可操作以将定向流体流发射到基座的一个或多个位置。 该装置还包括流体源，其连接到可移动分配头。 流体源提供流体以从基底中烧蚀材料。