公开(公告)号：US20050032398A1

公开(公告)日：2005-02-10

申请号：US10451667

申请日：2001-12-14

申请人： Francois Perret ,  Gerard Nemoz ,  Fabien Cognard ,  Jeanine Hugon ,  Elodie Cognard ,  Joel Sabourin

发明人： Francois Perret ,  Gerard Nemoz ,  Fabien Cognard ,  Jeanine Hugon ,  Elodie Cognard ,  Joel Sabourin

IPC分类号： H01R12/52 ,  H01R12/62 ,  H01R13/64 ,  H05K1/02 ,  H05K1/14 ,  H05K7/14 ,  H01R12/00

CPC分类号： H05K1/147 ,  H01R12/52 ,  H01R12/62 ,  H01R13/64 ,  H05K1/0218 ,  H05K1/144 ,  H05K3/0061 ,  H05K7/1452 ,  H05K7/1461 ,  H05K2201/10189

摘要： This interconnection module for the base of an electronic device casing carries out the transfer, at the faces of the printed circuit boards (4, 5) supporting the components of the device housed in the casing, of a field of connection points with the external environment of the casing embodied by the rear ends of the pins of a semi-connector 3 fixed to the back of the casing while still retaining the compactness of the casing despite a very large number of connection points with the external environment of the casing (several hundreds of them). This module takes the form of a three-panel structure with a central panel 7 fixed to the rear ends of the pins of the semi-connector (3) mounted on the back of the casing and two side panels (8, 9) folded and placed flat against each other, joined to the longitudinal edges of the central panel (7) by flexible printed circuit elements (10, 11) and supporting the field of connection points transferred to the level of the faces of the boards (4,5) of the electronic device. Electronic connections link the two fields of connection points in going through the joining parts (10, 11).

摘要翻译： 用于电子设备外壳的基座的该互连模块在支撑外壳中装置的部件的印刷电路板（4,5）的表面上进行与外部环境的连接点领域的传送 壳体由固定到壳体后部的半连接器3的销的后端实现，同时仍然保持壳体的紧凑性，尽管与外壳的外部环境有很多连接点（几百个 的）。 该模块采用三面板结构的形式，中央面板7固定到安装在壳体背面上的半连接器（3）的销的后端，并且两个侧板（8,9）折叠 彼此平放，通过柔性印刷电路元件（10,11）连接到中央面板（7）的纵向边缘并且支撑传递到板（4,5）的表面的水平面的连接点， 的电子设备。 电子连接通过连接部件（10,11）连接两个连接点领域。